Page 1 of 73

TLE9009DQU

Li-ion battery monitoring and balancing IC

Features

• Voltage monitoring of up to 9 battery cells connected in series

• Hot plugging support

• Dedicated 16-bit high precision delta-sigma ADC for each cell with

selectable measurement mode

• High-accuracy measurement with typical ±0.2 mV initial accuracy at

ambient temperature with a typical lifetime adder of 1 LSB after 10 years of

usage

• Integrated stress sensor with digital compensation algorithm and

temperature-compensated measurements

• Secondary ADC with identical averaging filter characteristics as advanced

end-to-end safety mechanism

• Five temperature measurement channels for external NTC elements

• Two internal temperature sensors

• Integrated balancing switch allows up to 200 mA balancing current

• Differential robust serial 2 Mbit/s communication interface with up to 38

devices

• Additional four GPIO pins to e.g. connect an external EEPROM and PWM

driver

• Internal round robin cycle routine triggers majority of diagnostics

mechanisms

- Automatic balancing overcurrent and undercurrent detection

- Automatic open load and open wire detection

- Automatic NTC measurement unit monitoring

• End-to-end CRC secured iso UART/UART communication

• Wake from bus capability (EMM)

• ISO 26262 Safety Element out of Context for safety requirements up to

ASIL D

• Green Product (RoHS compliant)

Potential applications

Multi-cell battery monitoring and balancing system IC designed for Li-ion battery packs used in hybrid electric

vehicles (HEV), plug-in hybrid electric vehicles (PHEV), battery electric vehicles (BEV) as well as in 12 V/48 V Li-

ion batteries and energy storage systems (ESS).

Product validation

Qualified for automotive applications. Product validation according to AEC-Q100.

Datasheet

Please read the sections "Important notice" and "Warnings" at the end of this document Rev. 1.0

www.infineon.com/battery-management-systems 2024-09-15

Page 2 of 73

Description

The device is a IC for lithium-ion battery cell management. The main function is to measure all cell voltages in

parallel with high precision and accuracy as well as temperatures. Additionally, the device is able to individually

and parallelly balance all cell voltages. The device offers a UART interface and an isolated daisy chain interface

called iso UART for communication with the host controller. The small package design and robust technology

enables a lean design and a ultra low bill of materials.

Type Package Marking

TLE9009DQU PG-TQFP-48 TLE9009DQU

TLE9009DQU

Li-ion battery monitoring and balancing IC

Description

Datasheet 2 Rev. 1.0

2024-09-15

Page 3 of 73

Table of contents

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Potential applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Product validation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Table of contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2 Pin configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6

2.1 Pin assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

2.2 Pin definitions and functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

3 General product characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

3.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

3.2 Functional range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

3.3 Thermal resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

4 Monitoring of internal oscillators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

4.1 Electrical characteristics monitoring of internal oscillators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

5 Power Management Unit (PMU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

5.1 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15

5.2 Electrical characteristics power management unit (PMU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

6 Watchdog and wake-up function (WD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20

6.1 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20

6.2 Electrical characteristics watchdog and wake-up function (WD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

7 Measurement control (MC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24

7.1 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24

7.2 Electrical characteristics measurement control (MC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

8 Primary cell voltage measurement (PCVM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

8.1 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28

8.2 Electrical characteristics primary cell voltage measurement (PCVM) . . . . . . . . . . . . . . . . . . . . . . . . . 28

9 Secondary cell voltage measurement (SCVM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

9.1 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32

9.2 Electrical characteristics secondary cell voltage measurement (SCVM) . . . . . . . . . . . . . . . . . . . . . . .32

10 Block voltage measurement (BVM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

10.1 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34

10.2 Electrical characteristics block voltage measurement (BVM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

11 Auxiliary voltage measurement (AVM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

11.1 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36

TLE9009DQU

Li-ion battery monitoring and balancing IC

Table of contents

Datasheet 3 Rev. 1.0

2024-09-15

Page 4 of 73

11.2 Electrical characteristics auxiliary voltage measurement (AVM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

12 Temperature measurement unit (TMP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

12.1 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37

12.2 Electrical characteristics temperature measurement (TMP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39

13 Cell balancing (CB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

13.1 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42

13.2 Electrical characteristics cell balancing (CB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

14 Cell diagnostics (CD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

14.1 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46

14.2 Electrical characteristics cell diagnostics (CD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

15 General-purpose input/output (GPIO/PWM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

15.1 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49

15.2 Electrical characteristics general-purpose input/output (GPIO/PWM) . . . . . . . . . . . . . . . . . . . . . . . . 49

16 Communication . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

16.1 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51

16.1.1 Register write modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53

16.1.2 Communication frames . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53

16.1.3 Register read modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

16.2 Electrical characteristics communication . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

17 Round robin (RR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57

17.1 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57

17.2 Electrical characteristics round robin (RR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61

18 Emergency mode (EMM) and ERR pin (ERR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63

18.1 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .63

18.2 Electrical characteristics emergency mode (EMM) and ERR pin (ERR) . . . . . . . . . . . . . . . . . . . . . . . . 67

19 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .68

19.1 External circuitry and components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .68

19.2 Typical application diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70

20 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71

21 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72

Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73

TLE9009DQU

Li-ion battery monitoring and balancing IC

Table of contents

Datasheet 4 Rev. 1.0

2024-09-15

Page 5 of 73

1 Block diagram

Cell Management Unit

U9

G8

U8

G7

U7

U9P

G1

U1

G0

U0

GND

IFH_L IFH_H

IFL_H

IFL_L

VDDC

VIO

VS

TMP1

TMP4

U2

VREGOUT

TMP_GND

iso UART

Interface

Low-Side

iso UART

Interface

High-Side

TMP3

Temperature

Mesurement

Unit

TMP2

TMP0

Power Management Unit

Main regulator

Ref. A

ΔΣ ADC 16bit

Chan. #8

Sleep regulator

Main oscillator Sleep oscillator

Device watchdog (WD)

incl. extended WD

Power management diagnosis

P

COMP

#8

Ref. A

ΔΣ ADC 16bit

Chan. #7

P

COMP

#7

Ref. A

ΔΣ ADC 16bit

Chan. #1

P

COMP

#1

Ref. A

ΔΣ ADC 16bit

Chan. #0

P

COMP

#0

Ref. B

DAC 11bit

SAR MUX

SAR

11bit

Ref. B

ΔΣ ADC 16bit

Block #10

Digital Control

&

Registers

GPIO0/UART_LS

GPIO1/UART_HS

UART /

PWM/

GPIO

ERR

Diagnosis Unit

incl. Round

Robin

REF. B

GND

VDDB

REF. A

GND

VDDA

PWM0

PWM1

DIAG

DIAG

DIAG

DIAG

Figure 1 Block diagram

TLE9009DQU

Li-ion battery monitoring and balancing IC

1 Block diagram

Datasheet 5 Rev. 1.0

2024-09-15

Page 6 of 73

2 Pin configuration

2.1 Pin assignment

1G2

2U2

3G1

4U1

5G0

6U0

7n. c.

8n. c.

9n. c.

10n. c.

11n. c.

12n. c.

13

TMP4

14

TMP3

15

GND

16

TMP2

17

TMP1

18

TMP0

19

TMP_GND

20

PWM1

21

PWM0

22

GND

23

IFL_L

24

IFL_H

25 IFH_H

26 IFH_L

27 VDDC

28 GPIO0 / UART_LS

29 GPIO1 / UART_HS

30 VIO

31 VREGOUT

32 n. c.

33 ERR

34 VS

35 U9P

36 U9

37

G8

38

U8

39

G7

40

U7

41

G6

42

U6

43

G5

44

U5

45

G4

46

U4

47

G3

48

U3

Figure 2 Pin assignment

2.2 Pin definitions and functions

Pin

Symbol Pin type Function

1 G2             A_I / O Cell-balancing channel 2.

2 U2 A_I Cell voltage measurement channel 2, negative terminal (positive terminal of cell 1).

TLE9009DQU

Li-ion battery monitoring and balancing IC

2 Pin configuration

Datasheet 6 Rev. 1.0

2024-09-15

Page 7 of 73

Pin  Symbol Pin type Function

3 G1 A_I / O Cell-balancing channel 1.

4 U1 A_I Cell voltage measurement channel 1, negative terminal (positive terminal of cell 0).

5 G0 A_I / O Cell-balancing channel 0.

6 U0 A_I Cell voltage measurement channel 0, negative terminal (same potential as local

GND).

7 n. c.   Not connected. Connect to U0 in application.

8 n. c.   Not connected. Connect to U0 in application.

9 n. c.   Not connected. Connect to U0 in application.

10 n. c.   Not connected. Connect to U0 in application.

11 n. c.   Not connected. Connect to U0 in application.

12 n. c.   Not connected. Connect to U0 in application.

13 TMP4 IO Temperature sensor 4. If not used connect pin to GND via a pull-down resistor > 10

k Ω . If TMP4 is disabled, the pin can be used as 0 to 2 V auxiliary ADC miscellaneous

pin.

14 TMP3 IO Temperature sensor 3. If not used connect pin to GND via a pull-down resistor > 10

k Ω . If TMP3 is disabled, the pin can be used as 0 to 2 V auxiliary ADC miscellaneous

pin.

15 GND GND Local GND of CSC (cell supervision circuit) device

16 TMP2 IO Temperature sensor 2. If not used connect pin to GND via a pull-down resistor > 10

k Ω . If TMP2 is disabled, the pin can be used as 0 to 2 V auxiliary ADC miscellaneous

pin.

17 TMP1 IO Temperature sensor 1. If not used connect pin to GND via a pull-down resistor > 10

k Ω . If TMP1 is disabled, the pin can be used as 0 to 2 V auxiliary ADC miscellaneous

pin.

18 TMP0 IO Temperature sensor 0. If not used connect pin to GND via a pull-down resistor > 10

k Ω . If TMP0 is disabled, the pin can be used as 0 to 2 V auxiliary ADC miscellaneous

pin.

19 TMP_GN

D

IO Temperature sensor reference. This pin can be connected to local GND.

20 PWM1 IO PWM output channel 1. This pin also has a general purpose input/output function.

If not used connect pin to GND via a pull-down resistor > 10 k Ω .

21 PWM0 IO PWM output channel 0. This pin also has a general purpose input/output function.

If not used connect pin to GND via a pull-down resistor > 10 k Ω .

22 GND GND Local GND of CSC device (cell supervision circuit).

23 IFL_L D_I / O Lower isolated UART (iso UART) L pin.

24 IFL_H D_I / O Lower isolated UART (iso UART) H pin.

25 IFH_H D_I / O Upper isolated UART (iso UART) H pin.

26 IFH_L D_I / O Upper isolated UART (iso UART) L pin.

27 VDDC Supply Buffer capacitor pin for internal iso UART supply.

TLE9009DQU

Li-ion battery monitoring and balancing IC

2 Pin configuration

Datasheet 7 Rev. 1.0

2024-09-15

Page 8 of 73

Pin  Symbol Pin type Function

28 GPIO0 /

UART_LS

D_I / O General-purpose input/output channel 0. This pin also has the function of

UART_LS. If not used connect pin to GND.

29 GPIO1 /

UART_HS

D_I / O General-purpose input/output channel 1. This pin also has the function of

UART_HS. If not used connect pin to GND.

30 VIO S Supply for GPIO interface.

31 VREGOU

T

S Output pin for the internal regulator.

32 n. c. n. c. Not connected. Connect to GND in application.

33 ERR HV_D_O Error output to microcontroller; open drain PMOS connected to VS. If not used,

leave unconnected.

34 VS S Supply pin of internal regulator V

VREGOUT

.

35 U9P S Positive supply pin. Connect to positive terminal of topmost cell in block. Input for

the sleep regulator.

36 U9 A_I Cell voltage measurement channel 8, positive terminal (most upper cell in the

block).

37 G8 A_I / O Cell-balancing channel 8.

38 U8 A_I Cell voltage measurement channel 8, negative terminal (positive terminal of cell 7).

39 G7 A_I / O Cell-balancing channel 7.

40 U7 A_I Cell voltage measurement channel 7, negative terminal (positive terminal of cell 6).

41 G6 A_I / O Cell-balancing channel 6.

42 U6 A_I Cell voltage measurement channel 6, negative terminal (positive terminal of cell 5).

43 G5 A_I / O Cell-balancing channel 5.

44 U5 A_I Cell voltage measurement channel 5, negative terminal (positive terminal of cell 4).

45 G4 A_I / O Cell-balancing channel 4.

46 U4 A_I Cell voltage measurement channel 4, negative terminal (positive terminal of cell 3).

47 G3 A_I / O Cell-balancing channel 3.

48 U3 A_I Cell voltage measurement channel 3 negative terminal (positive terminal of cell 2).

49 Exposed

Pad

GNDA Cooling tab. Connect to GND in the application.

Pin types: A = analog, D = digital, HV = high-voltage, I = input, O = output, I/O = bidirectional, P = power, S =

supply

TLE9009DQU

Li-ion battery monitoring and balancing IC

2 Pin configuration

Datasheet 8 Rev. 1.0

2024-09-15

Page 9 of 73

3 General product characteristics

Within the functional or operating range, the IC operates as described in the circuit description. The electrical

characteristics are specified within the conditions given in the electrical characteristics table.

This thermal data was generated in accordance with JEDEC JESD51 standards. For more information, go to

www.jedec.org.

3.1 Absolute maximum ratings

Table 1 Absolute maximum ratings

T

j

= -40°C to +150°C, all voltages with respect to GND, positive current flowing into pin (unless otherwise

specified)

Parameter Symbol Values Unit Note or condition P-

Number

Min. Typ. Max.

Voltages

Supply

voltage VS

V

VS_max

-0.3 – 75 V – PRQ-486

Supply

voltage VS

relative

V

VS_rel_max

V

VREG

OUT

-

0.3

– – V – PRQ-489

Transient

high voltage

V

transient_hi

gh_max

75 – 90 V Maximum transient duration 60 sec. Valid

for following pins vs. GND: VS, U9P, U9, Gn,

Un (0 ≤ n ≤ 8)

PRQ-1862

Supply

voltage U9P

V

U9P_max

-0.3 – 75 V – PRQ-1861

Supply

voltage VIO

V

VIO_max

-0.3 – 5.5 V – PRQ-488

Regulator

output

VREGOUT

V

VREGOUT_

max

-0.3 – 3.6 V – PRQ-490

Regulator

output VDDC

V

VDDC_max

-0.3 – 3.6 V Assuming  I

VDDC

≤ 1 mA continuous current PRQ-491

Cell sense

input voltage

absolute Un

V

Un_max

-0.3 – 75 V 0 ≤ n ≤ 9 PRQ-1863

Cell sense

input

voltages

relative Un

V

Un_rel_max

V

Un-1

- x

– V

Un-1

+ 9

V 1. 1 ≤ n ≤ 9

2. x = -0.0016 ×  T

j

+ 0.54

3. Typical clamping voltage

4. Maximum allowed current into/out

of the pin: 40 mA

5. For 7.5 V < V

Un

< 9 V: Current flowing

into the pin is below 10 mA

PRQ-1864

(table continues...)

TLE9009DQU

Li-ion battery monitoring and balancing IC

3 General product characteristics

Datasheet 9 Rev. 1.0

2024-09-15

Page 10 of 73

Table 1 (continued) Absolute maximum ratings

T

j

= -40°C to +150°C, all voltages with respect to GND, positive current flowing into pin (unless otherwise

specified)

Parameter Symbol Values Unit Note or condition P-

Number

Min. Typ. Max.

Cell

balancing pin

absolute Gn

V

Gn_max

-0.3 – 75 V 0 ≤ n ≤ 8 PRQ-1866

Cell

balancing

pins relative

Gn

V

Gn_rel_max

V

Un

-

0.3

– V

Un+1

+ 0.3

V 0 ≤ n ≤ 8 PRQ-1867

General

purpose I/O

voltages

absolute

GPIOq

V

GPIOq_max

-0.3 – 5.5 V 0 ≤ q ≤ 1 PRQ-505

General

purpose I/O

voltages

relative

GPIOq

V

GPIOq_rel_

max

-0.3 – V

VIO

+ 0.3

V 0 ≤ q ≤ 1 PRQ-506

Open drain

output pin

absolute ERR

V

ERR_max

-0.3 – 75 V – PRQ-510

Open drain

output pin

relative ERR

V

ERR_rel_ma

x

-0.3 – V

VS

+

0.3

V – PRQ-509

iso UART

interface

IFL_x

V

IFL_L_max

V

IFL_H_max

-4.1 – 6.6 V

1)

BCI test maximum 300 mA injected via

twisted pair cable onto iso UART interface

(maximum pin current 150 mA)

PRQ-493

iso UART

interface

IFH_x

V

IFH_L_max

V

IFH_H_max

-4.1 – 6.6 V

1)

BCI test maximum 300 mA injected via

twisted pair cable onto iso UART interface

(maximum pin current 150 mA)

PRQ-492

Temperature

sensor input

voltages

absolute

TMPz

V

TMPz_max

-0.3 – 3.63 V 0 ≤ z ≤ 4  PRQ-863

(table continues...)

TLE9009DQU

Li-ion battery monitoring and balancing IC

3 General product characteristics

Datasheet 10 Rev. 1.0

2024-09-15

Page 11 of 73

Table 1 (continued) Absolute maximum ratings

T

j

= -40°C to +150°C, all voltages with respect to GND, positive current flowing into pin (unless otherwise

specified)

Parameter Symbol Values Unit Note or condition P-

Number

Min. Typ. Max.

Temperature

sensor input

voltages

relative TMPz

V

TMPz_rel_m

ax

-0.3 – V

VREG

OUT

+

0.3

V 0 ≤ z ≤ 4  PRQ-864

Temperature

sensor input

voltage

absolute

TMP_GND

V

TMP_GND_

max

-0.3 – 2.75 V – PRQ-503

Temperature

sensor input

voltages

relative

TMP_GND

V

TMP_GND_r

el_max

-0.3 – V

VREG

OUT

+

0.3

V – PRQ-504

Pulse width

modulation

I/O voltages

absolute

PWMp

V

PWMp_max

-0.3 – 5.5 V 0 ≤ p ≤ 1  PRQ-865

Pulse width

modulation

I/O voltages

relative

PWMp

V

PWMp_rel_

max

-0.3 – V

VIO

+ 0.3

V 0 ≤ p ≤ 1  PRQ-866

Ground pin

GND

V

GND

0 – 0 V Absolute GND PRQ-511

ESD robustness

ESD

robustness 2

kV

V

ESD_2kV_m

ax

-2 – 2 kV

2)

HBM; all pins

PRQ-514

ESD

robustness 4

kV

V

ESD_4kV_m

ax

-4 – 4 kV

2)

HBM; robustness versus GND for pins: VS,

U9P, Un, Gn, TMPz, TMP_GND, IFH_x, IFL_x

PRQ-1865

ESD

robustness

CDM 500 V

V

ESD_cdm_al

l_max

-500 – 500 V

3)

CDM; all pins

PRQ-516

ESD

robustness

CDM 750 V

V

ESD_Corner

_max

-750 – 750 V

3)

CDM; corner pins

PRQ-517

(table continues...)

TLE9009DQU

Li-ion battery monitoring and balancing IC

3 General product characteristics

Datasheet 11 Rev. 1.0

2024-09-15

Page 12 of 73

Table 1 (continued) Absolute maximum ratings

T

j

= -40°C to +150°C, all voltages with respect to GND, positive current flowing into pin (unless otherwise

specified)

Parameter Symbol Values Unit Note or condition P-

Number

Min. Typ. Max.

Temperatures

Junction

temperature

T

j_max

-40 – 150 °C – PRQ-512

Storage

temperature

T

stg_max

-55 – 150 °C – PRQ-513

1) Positive and negative transients with a maximum duration of 100 ns allowed between ± 8 V; This should simulate ESD events;

however, during normal and steady-state condition voltage on these pins must stay inside the maximum ratings specified.

2) ESD robustness, HBM according to ANSI/ESDA/JEDEC JS-001 (1.5 k Ω , 100 pF).

3) ESD robustness, Charged Device Model JESD22-C101.

Notes:

1. Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

2. Integrated protection functions are designed to prevent IC destruction under fault conditions described in the

datasheet. Fault conditions are considered as outside normal operating range. Protection functions are not

designed for continuous repetitive operation.

3.2 Functional range

Table 2 Functional range

T

j

= -40°C to +150°C, all voltages with respect to GND, positive current flowing into pin (unless otherwise

specified)

Parameter Symbol Values Unit Note or condition P-

Number

Min. Typ. Max.

Supply

voltage VS

V

VS_function

al

4.75 – 60 V – PRQ-518

Supply

voltage U9P

V

U9P_functio

nal

4.75 – 45 V – PRQ-1868

Supply

voltage VIO

V

VIO_functio

nal

3 – 5.5 V – PRQ-520

Cell sense

input voltage

Un

V

Un_function

al

V

Un-1

- x

– V

Un-1

+ 7

V 1. 1 ≤ n ≤ 9

2. x = -0.0016 × T

j

+ 0.54

PRQ-1869

TLE9009DQU

Li-ion battery monitoring and balancing IC

3 General product characteristics

Datasheet 12 Rev. 1.0

2024-09-15

Page 13 of 73

3.3 Thermal resistance

Table 3 Thermal resistance

V

VS

= V

VS_functional

, T

j

= -40°C to +150°C, all voltages with respect to GND, positive current flowing into pin (unless

otherwise specified)

Parameter Symbol Values Unit Note or condition P-

Number

Min. Typ. Max.

Junction to

case

R

thJC

– 7 – K/W

1)

PRQ-1921

Junction to

ambient

R

thJA

– 32 – K/W

1) 2)

PRQ-1922

1) Not subject to production test, specified by design.

2) Specified  R thJA value is according to JEDEC JESD51-5,-7 at natural convection on FR4 2s2p board; The product (chip

and package) was simulated on a 76.2 × 114.3 × 1.5 mm board with 2 inner copper layers (2 × 70 μm Cu, 2 × 35 μm Cu). The thermal

via array under the exposed pad consists of 16 vias with a diameter of 0.3 mm and a plating thickness of 25 μm.

TLE9009DQU

Li-ion battery monitoring and balancing IC

3 General product characteristics

Datasheet 13 Rev. 1.0

2024-09-15

Page 14 of 73

4 Monitoring of internal oscillators

The IC includes monitoring of two internal oscillators:

1. Main oscillator operating at f

main_osc

2. Sleep oscillator operating at f

sleep_osc

→ in sleep mode only the sleep mode oscillator is active

In normal mode both oscillators are active. The oscillators monitor each other for drift and stuck-at errors. As

soon as the IC detects an error, it enters sleep mode. The oscillator error prevents reliable writing to any register

and hence the IC does not set any error bit before entering sleep mode.

4.1 Electrical characteristics monitoring of internal oscillators

Table 4 Electrical characteristics

V

VS

= V

VS_functional

,  T

j

= -40°C to +150°C, all voltages with respect to GND, positive current flowing into pin (unless

otherwise specified)

Parameter Symbol Values Unit Note or condition P-

Number

Min. Typ. Max.

Oscillator

Main unit

oscillator

frequency

f

main_osc

13.4

4

14 14.5

6

MHz – PRQ-564

Sleep unit

oscillator

frequency

f

sleep_osc

90 100 110 kHz – PRQ-565

TLE9009DQU

Li-ion battery monitoring and balancing IC

4 Monitoring of internal oscillators

Datasheet 14 Rev. 1.0

2024-09-15

Page 15 of 73

5 Power Management Unit (PMU)

5.1 Functional description

The IC has an internal power supply unit connected to the pins VS, U9P and GND. It consumes energy from the

monitored battery cells and generates the internal supply voltages for the IC as well as the output

voltages  V

VDDC

and V

VREGOUT

.

Note: The output pins VDDC and VREGOUT

require a capacitance to ground as stated in the Application

information/External components.

Note: No supply currents are drawn from Un pins.

Reg

3V3

GPIO

Analog

VREGOUT

VS

VIO

VDDC

GND

U9P

Reg

startup

R

F

Comm

IF

V_Bl+

V_Bl-

3.3 / 5V

3.3 V

U9

R

F

U8

R

F

Reg

Logic

C

VDDC

C

VREGOUT

C

U9P

C

VS

If GPIOs

are used

R

U9P

R

VS

Figure 3 Typical power supply configuration using the internal voltage regulator

The IC has a sleep mode with reduced current consumption supplied via U9P and GND.

The IC can be put into sleep mode by setting the sleep mode bit. The sleep mode features a reduced current

consumption,  I

U9P_sleep

, supplied via U9P and GND.

To supply the communication interface, the device provides a regulated output voltage V

VDDC

on pin VDDC.

If the voltage V

VDDC

falls below the undervoltage threshold V

VDDC_th_UV

for a longer time than  t

PS_ERR_deg

, then

the IC enters sleep mode. The power supply error sleep bit in the general diagnostics register indicate a fault,

which can be read after waking the IC.

The device provides a regulated output voltage V

VREGOUT

with an output current I

VREGOUT

on pin VREGOUT which

can supply the GPIOs of the device or other loads.

The multi purpose supply incorporates an overcurrent protection. If the current I

VREGOUT

exceeds I

VREGOUT_th_OC

for a longer time than t

PS_ERR_deg

, then it switches off the output voltage supply. The IC enters sleep mode after

the deglitching time t

PS_ERR_deg

. The power supply error sleep bit in the general diagnostics register indicates a

fault, which can be read after waking up the IC.

TLE9009DQU

Li-ion battery monitoring and balancing IC

5 Power Management Unit (PMU)

Datasheet 15 Rev. 1.0

2024-09-15

Page 16 of 73

The voltage at the VIO pin sets the logic levels and supplies the GPIOs. The pin can be connected directly to the

VREGOUT pin or to another desired voltage level using an external regulator.

If the voltage V

VIO

falls below the undervoltage threshold V

VIO_th_UV_fall

for a longer time than

t

PS_ERR_deg

,

then the IC sets the VIO undervoltage error bit in the general purpose input/output register. After V

VIO

has

exceeded the V

VIO_th_UV_rise

threshold for longer than

t

PS_ERR_deg

, the UV_VIO bit can be cleared with a write

command.

Note: If the GPIO.VIO_UV bit is 0, the GPIO functionality is enabled and wake-up via GPIO is possible.

IC enters sleep

mode

Set

PS_ERR_SLEEP

bit in GEN_DIAG

register

I

VREGOUT

I

VREGOUT_th_OC

V

VDDC

V

VDDC_th_UV

V

VIO

V

VIO_th_UV

deglitch

( t

PS_ERR_deg

)

Set VIO_UV bit in

GPIO register

deglitch

( t

PS_ERR_deg

)

deglitch

( t

PS_ERR_deg

)

Figure 4 Power supply monitoring

The IC ensures wake-up and operation even if any single wire connected to a cell is open in case of

failure (assumption: U9P and VS connected on PCB level). If an absolute maximum rating is violated due to an

open wire, then performance degradation may occur.

5.2 Electrical characteristics power management unit (PMU)

Table 5 Electrical characteristics

V

VS

= V

VS_functional

, T

j

= -40°C to +150°C, all voltages with respect to GND, positive current flowing into pin (unless

otherwise specified)

Parameter Symbol Values Unit Note or condition P-

Number

Min. Typ. Max.

Internal regulators

VREGOUT

internal

regulator

output

voltage

V

VREGOUT

3.3 3.45 3.6 V – PRQ-544

VDDC output

voltage

V

VDDC

2.42 2.5 2.63 V – PRQ-549

(table continues...)

TLE9009DQU

Li-ion battery monitoring and balancing IC

5 Power Management Unit (PMU)

Datasheet 16 Rev. 1.0

2024-09-15

Page 17 of 73

Table 5 (continued) Electrical characteristics

V

VS

= V

VS_functional

, T

j

= -40°C to +150°C, all voltages with respect to GND, positive current flowing into pin (unless

otherwise specified)

Parameter Symbol Values Unit Note or condition P-

Number

Min. Typ. Max.

Supply currents

Current

consumption

in 100 ms

period - RT

I

VS_100ms_c

yc_RT

5.4 5.6 5.8 mA 1. T

j

= 25°C

2. Assumed cycle 100 ms period and

16-Bit mode (EN_ALL_ADC = 1)

• 5% cell Voltage Measurement

• 40% NTC current source

activated

• 5% diagnostics (Temperature

and RR)

• 7% communication

• 43% idle

3. Current to charge-up external

interface components not included

(see I

VS_comm_ext

)

PRQ-563

U9P sleep

mode current

I

U9P_sleep

– 2.5 9.9 μA 1. Typical value at  T

j

= 25°C

2. -40°C ≤  T

j

≤ 85°C;

3. Round robin in sleep mode

deactivated

PRQ-1870

U9P sleep

mode current

- room

temperature

I

U9P_sleep_R

T

– 2.5 3.5 μA T

j

= 25°C PRQ-1871

U9P idle

current

I

U9P_idle

– 2.5 10 μA IC in idle mode PRQ-1872

VS sleep

mode

leakage

current

I

VS_sleep

-1 – 1 μA -40°C <  T

j

< 85°C PRQ-555

VS idle

current

I

VS_idle

– 4.9 6.5 mA IC in idle mode PRQ-557

VREGOUT

current

consumption

multi

purpose

supply

I

VREGOUT

– – 5 mA No load on VIO PRQ-1373

(table continues...)

TLE9009DQU

Li-ion battery monitoring and balancing IC

5 Power Management Unit (PMU)

Datasheet 17 Rev. 1.0

2024-09-15

Page 18 of 73

Table 5 (continued) Electrical characteristics

V

VS

= V

VS_functional

, T

j

= -40°C to +150°C, all voltages with respect to GND, positive current flowing into pin (unless

otherwise specified)

Parameter Symbol Values Unit Note or condition P-

Number

Min. Typ. Max.

VIO current

consumption

during GPIO

communicati

on

I

VIO_comm

– – 5 mA No load on VREGOUT PRQ-558

VS current

consumption

during PCVM,

SCVM and

BVM

measuremen

t

I

VS_meas

– 22.5 24 mA 1. PCVM (EN_ALL_ADC = 1)

2. SCVM

3. BVM

4. VIO connected to VREGOUT

5. Including idle consumption  I

VS_idle

PRQ-559

VS current

consumption

during round

robin scheme

running

I

VS_RR

– 9.0 11 mA 1. Average current consumption

during round robin

2. VIO connected to VREGOUT

3. Including idle consumption  I

VS_idle

4. NR_TEMP_SENSE ≥ 2, EN_ALL_ADC

= 1, CVM_DEL = 0x01

PRQ-560

VS current

consumption

during

communicati

on

I

VS_comm

– I

VS_idl

e_typ

+ 0.9

I

VS_idl

e_max

+ 1.2

mA

1)

1. GPIO communication.

2. Current to charge external interface

components not included.

PRQ-561

VS current

consumption

during iso

UART

communicati

on including

external

interface

components

I

VS_comm_is

oU

– – I

VS_co

mm

+

7.6

mA

1)

1. C

ser

= 1 nF

2. BR

iso_U

= 2 Mbit/s

3. R

ser

= 39 Ω

4. C

isoUART_F

= 220 pF

5. Valid for one iso UART interface in

TX mode

PRQ-562

Protection and Detection

VREGOUT

overcurrent

threshold

I

VREGOUT_th

_OC

31 40 60 mA Tested during idle mode PRQ-545

VIO

undervoltage

threshold

falling

V

VIO_th_UV_f

all

2.2 – 2.76 V – PRQ-546

(table continues...)

TLE9009DQU

Li-ion battery monitoring and balancing IC

5 Power Management Unit (PMU)

Datasheet 18 Rev. 1.0

2024-09-15

Page 19 of 73

Table 5 (continued) Electrical characteristics

V

VS

= V

VS_functional

, T

j

= -40°C to +150°C, all voltages with respect to GND, positive current flowing into pin (unless

otherwise specified)

Parameter Symbol Values Unit Note or condition P-

Number

Min. Typ. Max.

VIO

undervoltage

threshold

rising

V

VIO_th_UV_r

ise

2.24 – 2.9 V – PRQ-547

VIO

undervoltage

threshold

hysteresis

V

VIO_th_UV_

hys

40 100 160 mV – PRQ-548

VDDC

undervoltage

threshold

V

VDDC_th_U

V

2.15 – 2.42 V – PRQ-550

VDDC

undervoltage

threshold

hysteresis

V

VDDC_th_U

V_hys

80 100 140 mV – PRQ-551

Power supply

error

detection

deglitch time

t

PS_ERR_deg

8 15 24 μs

1)

PRQ-552

1) Not subject to production test; verified by design or characterization.

TLE9009DQU

Li-ion battery monitoring and balancing IC

5 Power Management Unit (PMU)

Datasheet 19 Rev. 1.0

2024-09-15

Page 20 of 73

6 Watchdog and wake-up function (WD)

6.1 Functional description

The following events trigger a wake-up:

1. A wake-up pattern received via the iso UART or UART interfaces. The signal alternates with the frequency

f

WAKEUP

. After   n

WAKE_det

signal periods received by the IC, it performs a wake-up. The IC completes the

wake-up process within  t

wake

. After that the IC forwards the same wake-up signal for  n

WAKEUP

periods.

The IC forwards a wake-up signal received via UART to the iso UART interface, a wake-up signal received

via iso UART to the adjacent iso UART interface.

2. A round robin sleep timeout.

3. An EMM signal recognized as wake-up signal.

The IC generates the wake-up pattern on:

• IFL, if the IC received a valid wake-up pattern on interface IFH.

- (1) indicates the source of wake-up, (2) indicates the propagation on IFL_x

• IFH, if the IC received a valid wake-up pattern on interface IFL.

- (3) indicates the source of wake-up, (4) indicates the propagation on IFH_x

• IFL, if the IC received a valid wake-up pattern on interface GPIO1/UART_HS.

- (5) indicates the source of wake-up, (6) indicates the propagation on IFL_x

• IFH, if the IC received a valid wake-up pattern on interface GPIO0/UART_LS.

- (7) indicates the source of wake-up, (8) indicates the propagation on IFH_x

TLE9009DQU

Li-ion battery monitoring and balancing IC

6 Watchdog and wake-up function (WD)

Datasheet 20 Rev. 1.0

2024-09-15

Page 21 of 73

Sensing IC

Sleep mode

RX

GPIO1/

UART_HS

GPIO0/

UART_LS

IFL_L

IFL_H

IFH_L

IFH_H

RX

Sensing IC

RX – RX

Direction set

TX - TX

Direction set

RX

TX

GPIO1/

UART_HS

GPIO0/

UART_LS

IFL_L

IFL_H

IFH_L

IFH_H

TX

RX

RX

RX

Primary on Top

Sensing IC

Sleep mode

RX

GPIO1/

UART_HS

GPIO0/

UART_LS

IFL_L

IFL_H

IFH_L

IFH_H

RX

Sensing IC

TX - TX

Dircetion set

RX – RX

Direction set

TX

RX

GPIO1/

UART_HS

GPIO0/

UART_LS

IFL_L

IFL_H

IFH_L

IFH_H

RX

TX

RX

RX

Primary on Bottom

Sensing IC

Sleep mode

IFL_L

IFL_H

Sensing IC

RX - TX

Direction set

IFL_L

IFL_H

TX

RX

Primary on Top

Sensing IC

Sleep mode

IFH_L

IFH_H

RX

Sensing IC

RX – TX

Direction set

IFH_L

IFH_H

TX

Primary on Bottom

(1)

(2)

(3)

(4)

IFH_L

RX

IFH_H

IFH_L

RX

IFH_H

IFL_L

IFL_H

RX

IFL_L

IFL_H

RX

(5)

(6)

(7)

(8)

Figure 5 Wake-up signal propagation

The device configures the communication interface automatically after wake-up.

The device configures the iso UART interface of the wake-up signal received as RX during idle mode (no

communication) until the next wake-up. The device configures the other iso UART interface as TX in idle mode

until the next wake-up.

The IC has a 7-bit watchdog counter which is counting downwards. The watchdog counter must be serviced via

an UART or iso UART command before it reaches 0. Otherwise the device enters sleep mode. The watchdog

counter can be set to maximum  t

WD_max

with a resolution of  t

WD_LSB

, via the watchdog counter register.

Note: After the IC wake-up, the watchdog counter is set to its maximum value t

WD_max

If a longer counter interval is needed, the IC can be put into an extended watchdog mode by setting the

operation mode register. In this mode the maximum time until the watchdog counter expires is defined by

t

WD_EXT_max

with a resolution of t

WD_EXT_LSB

. When the counter expires, the device enters sleep mode.

The device provides a free-running 9-bit main counter which is counting upwards and can be checked via the

communication interface reading the watchdog counter register.

The maximum length is t

Count_max

with a resolution of t

Count_LSB

. The precisely timed reading of the main

counter gives an indication of the main oscillator speed.

If bitfield RR_CONFIG.RR_SYNC is set, then a WDOG_CNT write command resets the main counter. This prepares

for a broadcast read of all main counters.

After the device wakes up on a standard wake-up signal the device's node ID is set to 0 by default. In this state,

the device does not forward any communication. A node ID other than 0 must be set in the address (ID) bits of

configuration register before the watchdog timer expires. Only then the device forwards communication.

Note: If an EMM signal is received, the device forwards it even though the device is not enumerated.

TLE9009DQU

Li-ion battery monitoring and balancing IC

6 Watchdog and wake-up function (WD)

Datasheet 21 Rev. 1.0

2024-09-15

Page 22 of 73

6.2 Electrical characteristics watchdog and wake-up function (WD)

Table 6 Electrical characteristics

V

VS

= V

VS_functional

, T

j

= -40°C to +150°C, all voltages with respect to GND, positive current flowing into pin (unless

otherwise specified)

Parameter Symbol Values Unit Note or condition P-

Number

Min. Typ. Max.

Wake-up function

WD wake-up

signal

frequency

f

WAKEUP

48 50 1040 kHz – PRQ-572

WD device

wake-up

time

t

WAKE

200 370 500 μs 48 kHz wake-up frequency.

From the first falling edge of the input

pattern to the first edge of the propagated

wake-up sequence.

PRQ-573

WD wake-up

- number of

detected

periods

n

WAKE_det

4 – 8 period

s

– PRQ-574

WD wake-up

propagation -

length in

periods

n

WAKE

8 – 8 period

s

– PRQ-575

Watchdog counter

WD interval

step

t

WD_LSB

14.5 16 17.8 ms

1)

EXT_WD = 0

PRQ-576

WD

maximum

interval

t

WD_max

1.8 2.03 2.3 s

1)

EXT_WD = 0

PRQ-578

WD interval

step -

extended

t

WD_EXT_LSB

13.5 15.0

7

17 min

1)

EXT_WD = 1

PRQ-577

WD

maximum

interval -

extended

t

WD_EXT_ma

x

28.9 31.9 35.5 h

1)

EXT_WD = 1

PRQ-579

Main counter

WD main

counter

interval step

t

Count_LSB

281 292.

57

305 μs

1)

PRQ-580

WD main

counter

maximum

interval

t

Count_max

144.

03

149.

8

156.

03

ms

1)

PRQ-581

TLE9009DQU

Li-ion battery monitoring and balancing IC

6 Watchdog and wake-up function (WD)

Datasheet 22 Rev. 1.0

2024-09-15

Page 23 of 73

1) Not subject to production test; verified by design or characterization.

TLE9009DQU

Li-ion battery monitoring and balancing IC

6 Watchdog and wake-up function (WD)

Datasheet 23 Rev. 1.0

2024-09-15

Page 24 of 73

7 Measurement control (MC)

7.1 Functional description

The various voltage measuring modules on the IC follow these rules:

• All voltage measurements (PCVM, SCVM, BVM, BAVM, AVM) can be manually triggered by a communication

command.

• A triggered measurement sets a lock bit which inhibits a measurement triggered by a cyclical task. The

device clears the lock bit after completion of the measurement.

• BVM, PCVM and SCVM can be triggered simultaneously.

• Bipolar auxiliary voltage measurement (BAVM), PCVM and SCVM can be triggered simultaneously.

The IC provides two independent reference voltages which are used with the SD-ADC blocks.

1. PCVM uses reference A.

2. BVM, AVM, and SCVM use reference B.

The resolution of the various voltage measurements is V

x_LSB

and is defined by the LSB of the digital conversion.

x=PCVM; SCVM; AVM; BVM

The measurement time  t

VM

of the PCVM, SCVM and BVM is configurable in the measurement control register.

PCVM/SCVM uses the cell voltage measurement mode bits, while BVM uses the block/auxiliary bits.

Table 7 Voltage measurement modes

CVM_Mode/ BVM_Mode

[2:0]

PCVM/BVM

resolution

[bit]

SCVM resolution

[bit]

t

VM

[ms]

111 14 11 t

VM_LR

110 16 11 4.68

101 15 11 2.34

100 14 11 1.17

011 13 11 0.59

010 12 11 0.29

001 11 11 0.15

000 10 11 0.07

Note: The resolution of AVM is 10 bit. The resolution of SCVM is 11 bit. t

vm

of SCVM is adjusted to CVM_MODE

configuration.

Setting the start bit of a measurement in the measurement control register initiates a voltage measurement.

The result of the measurement is the average of the cell voltage over the measurement time and is available in

the RESULT register.

The resolution of the measured value (in bit) can be configured using the measurement control register.

On completion of a measurement the device clears the corresponding start bit. For manually triggered

measurements (PCVM, SCVM, BVM), the result registers are set to 0 during measurement time t

VM

and

measurement delay time t

VM_DEL

, except in long-running mode.

In long-running mode, the result register is updated after the end of the measurement.

The result registers of the voltage measurement keep the results irrespective of internal cyclic diagnostics

checks.

The configurable delay time  t

VM_del

delays the start of the cell voltage, block voltage and bipolar auxiliary

voltage measurements (PCVM, SCVM, BVM and BAVM) with a resolution of  t

VM_del_LSB

.

The maximum delay time is defined by  t

VM_del_max

.

TLE9009DQU

Li-ion battery monitoring and balancing IC

7 Measurement control (MC)

Datasheet 24 Rev. 1.0

2024-09-15

Page 25 of 73

If the long-running mode is selected for PCVM and/or BVM by writing the corresponding bits in the

measurement control register, the IC measures eight times in a row using the 14-bit measurement mode. If the

long-running mode is selected for SCVM by writing the corresponding bits in the measurement control register,

the IC performs eight times several 11-bit measurements while the measurement time t

VM

of a 14-bit

measurement. After the long running measurements are finished the PCVM result register contains the average

of all 14-bit measurements while the SCVM result register contains the average value of all 11-bit

measurements.

Each of those measurements starts automatically after the time t

restart

, for a total measurement time

t

VM_LR

equals  t

VM_LR

= 8 * t

restart

.

The time t

restart

is defined by the configurable 6-bitfield of the operation mode register with a resolution

of  t

restart_LSB

within the range of t

restart_range

.

11-bit

meas

11-bit

meas

11-bit

meas

11-bit

meas

11-bit

meas

11-bit

meas

11-bit

meas

11-bit

meas

11-bit

meas

11-bit

meas

11-bit

meas

11-bit

meas

11-bit

meas

11-bit

meas

11-bit

meas

11-bit

meas

11-bit

meas

11-bit

meas

11-bit

meas

11-bit

meas

11-bit

meas

11-bit

meas

14-bit meas

t

restart

t

VM_del

PCVM / BVM

t

VM_14-bit

14-bit meas 14-bit meas 14-bit meas 14-bit meas 14-bit meas 14-bit meas 14-bit meas

Measurement

start command

8× t

restart

t

restart

t

VM_del

SCVM

t

VM_14-bit

Measurement

start command

8× t

restart

11-bit

meas

11-bit

meas

Figure 6 Voltage measurement long-running mode

7.2 Electrical characteristics measurement control (MC)

Table 8 Electrical characteristics

V

VS

= V

VS_functional

, T

j

= -40°C to +150°C, all voltages with respect to GND, positive current flowing into pin (unless

otherwise specified)

Parameter Symbol Values Unit Note or condition P-

Number

Min. Typ. Max.

MC PCVM,

BAVM, AVM

and BVM ADC

sampling

frequency

f

s_ADC

13.4

4

14 14.5

6

MHz

1)

PRQ-600

MC PCVM,

SCVM, BAVM

and BVM

propagation

delay within

IC

t

VM_prop

2.75

μs -

1/

BR

GP

IO

– 3.5

μs -

1/

BR

GP

IO

s

1)

Time between completion of a received

measurement start command and the

actual start of the measurement delay

time t

VM_del

.

PRQ-592

MC PCVM,

SCVM, BAVM

and BVM

start delay

timer

resolution

t

VM_del_LSB

35.1 36.6 38.1 μ s

1)

PRQ-593

(table continues...)

TLE9009DQU

Li-ion battery monitoring and balancing IC

7 Measurement control (MC)

Datasheet 25 Rev. 1.0

2024-09-15

Page 26 of 73

Table 8 (continued) Electrical characteristics

V

VS

= V

VS_functional

, T

j

= -40°C to +150°C, all voltages with respect to GND, positive current flowing into pin (unless

otherwise specified)

Parameter Symbol Values Unit Note or condition P-

Number

Min. Typ. Max.

MC PCVM,

SCVM, BAVM

and BVM

start delay

timer

maximum

interval

t

VM_del_max

1.09 1.13 1.18 ms

1)

PRQ-594

MC Voltage

measuremen

t time

t

VM

– 2

m

/  f

s_ADC

– s

1)

1. m bits: 10 ≤ m ≤ 16

2. Mode: CVM_MODE; BVM_MODE

3. Except for long-running mode

PRQ-602

Long-running mode

MC long-

running

mode restart

time - 1

t

restart_1

1.13 1.17 1.22 ms For LR_TIME = 00

H

PRQ-1919

MC long-

running

mode restart

time - 2

t

restart_2

1.20 1.25 1.3 ms For LR_TIME = 01

H

PRQ-1920

MC long-

running

mode restart

resolution

t

restart_LSB

100.

1

104.

1

108.

5

μs For LR_TIME > 01

H

PRQ-1297

MC long-

running

restart range

t

restart_rang

e

1.13 – 8.03 ms – PRQ-1312

Full scale ranges

MC PCVM,

SCVM and

comparator

full-scale

range

FSR

PCVM

FSR

SCVM

FSR

Comp

0 – 5 V

1)

PRQ-623

MC BVM full-

scale range

FSR

BVM

4.75 – 60 V

1)

Measured at  V

U9P

-  V

GND

PRQ-1924

MC BAVM full-

scale range

FSR

BAVM

-2 – 2 V – PRQ-1387

(table continues...)

TLE9009DQU

Li-ion battery monitoring and balancing IC

7 Measurement control (MC)

Datasheet 26 Rev. 1.0

2024-09-15

Page 27 of 73

Table 8 (continued) Electrical characteristics

V

VS

= V

VS_functional

, T

j

= -40°C to +150°C, all voltages with respect to GND, positive current flowing into pin (unless

otherwise specified)

Parameter Symbol Values Unit Note or condition P-

Number

Min. Typ. Max.

MC AVM and

TMP full-

scale range

FSR

AVM

FSR

TMP

0 – 2 V

1)

PRQ-792

Measurement resolution

MC PCVM

resolution

V

PCVM_LSB

– FSR

P

CVM

/

2

m

– V

1)

m bits: 10 ≤ m ≤ 16

PRQ-599

MC SCVM

resolution

V

SCVM_LSB

– FSR

S

CVM

/

2

11

– V

1)

PRQ-624

MC BVM

resolution

V

BVM_LSB

– FSR

B

VM

/

2

m

– V

1)

m bits: 10 ≤ m ≤ 16

PRQ-667

MC BAVM

resolution

V

BAVM_LSB

– FSR

B

AVM

/2

m

– V

1)

m bits: 10 ≤ m ≤ 16

PRQ-1388

MC AVM

resolution

V

AVM_LSB

– FSR

A

VM

/2

1

0

– V

1)

PRQ-682

1) Not subject to production test; verified by design or characterization.

TLE9009DQU

Li-ion battery monitoring and balancing IC

7 Measurement control (MC)

Datasheet 27 Rev. 1.0

2024-09-15

Page 28 of 73

8 Primary cell voltage measurement (PCVM)

8.1 Functional description

The primary cell voltage measurement (PCVM) unit of the IC can measure each cell voltage individually and

simultaneously using the Un pins. The measured voltage is defined as  V

PCVM

= ( V

Un+1

- V

Un

) (0 ≤ n ≤ 8) and is

measured with the defined accuracy  PCVM

ERR

and a relative accuracy of  PCVM

ERR_rel

.

The primary cell voltage measurement is initiated by setting the PCVM_START bitfield in the MEAS_CTRL

register. The primary cell voltage is calculated using:  V

PCVM

[V] = ( FSR

PCVM

/ 2

16

) × RESULT[LSB16]

The measurement is triggered by a host controller command synchronously for all cells connected to the IC.

These conditions apply:

• The maximum start measurement propagation delay is  t

VM_prop

.

• The maximum PCVM time

deviation between channels within one IC is  Dev

PCVM_IC

.

• The maximum PCVM time deviation across all ICs in a chain is  Dev

PCVM_chain.

• The start of the measurement is delayed by the configurable time t

VM_del

.

• The maximum iso UART propagation delay is t

isoU_prop_del

.

The number of activated cells can be configured in the PART_CONFIG register. With the register minimum value

0000

H

no cell is activated and with maximum value 0FF8

H

all 9 cells are activated.

8.2 Electrical characteristics primary cell voltage measurement (PCVM)

Table 9 Electrical characteristics

V

VS

=  V

VS_functional

, T

j

= -40°C to +150°C, all voltages with respect to GND, positive current flowing into pin (unless

otherwise specified)

Parameter Symbol Values Unit Note or condition P-

Number

Min. Typ. Max.

Cell sense inputs

PCVM

differential

input current

Un

I

Un_PCVM

18 25 32 μA 1. During PCVM

2. V

PCVM

= 5 V

3. This differential current flows

into Un+1 and has the opposite

direction on Un for the channels (0

≤ n ≤ 9)

4. The typical average value I

Un_PCVM

=

V

PCVM

/ 200 kΩ

PRQ-1879

Input leakage

current Un

I

Un_leak

-0.6 – 0.6 μA 1. 0 ≤ n ≤ 9

2. In sleep mode and idle mode

3. V

Un

≤ 5.5 V

PRQ-1895

(table continues...)

TLE9009DQU

Li-ion battery monitoring and balancing IC

8 Primary cell voltage measurement (PCVM)

Datasheet 28 Rev. 1.0

2024-09-15

Page 29 of 73

Table 9 (continued) Electrical characteristics

V

VS

=  V

VS_functional

, T

j

= -40°C to +150°C, all voltages with respect to GND, positive current flowing into pin (unless

otherwise specified)

Parameter Symbol Values Unit Note or condition P-

Number

Min. Typ. Max.

Synchronization timing

Maximum

PCVM time

deviation

between

channels

within IC

Dev

PCVM_IC

-0.5 – +0.5 %

1)

Deviation between t

VM

.

PRQ-596

Maximum

PCVM time

deviation

across ICs

Dev

PCVM_ch

ain

-4 – 4 %

1)

PRQ-597

Primary cell voltage measurement

PCVM

relative

accuracy

initial - RT

PCVM

ERR_i

nit

-0.8 – 0.8 mV

2)

3)

Relative accuracy over all devices against

each other within the given conditions:

1. 16-bit mode

2. ( V

Un+1

- V

Un

) = 4.3 V

3. T

j

= 25°C

PRQ-1880

PCVM

relative

accuracy

PCVM

ERR_r

el

-1 – 1 mV Relative accuracy over all devices against

each other within the given conditions:

1. 16-bit mode

2. Δ ( V

Un+1

- V

Un

) = 600 mV within 2.5 V

≤ ( V

Un+1

- V

Un

) ≤ 4.3 V

3. Δ T

j

= 10 K within -40°C ≤  T

j

≤ 70°C

4. Over a period of  t

0

and t

0+x

(x ≤ 12

hours)

4)

PRQ-1848

PCVM

accuracy EoL

- 1

PCVM

ERR_E

OL_1

-1.1 – 1.1 mV

5)

3) 6)

1. 2.5 V ≤ ( V

Un+1

- V

Un

)   ≤ 3.6 V

2. T

j

=  25°C

PRQ-1896

PCVM

accuracy EoL

- 2

PCVM

ERR_E

OL_2

-1.2 – 1.2 mV

5)

3) 6)

1. 16-bit mode

2. 3.6 V < ( V

Un+1

- V

Un

) ≤ 4.3 V

3. T

j

= 25°C

PRQ-1897

PCVM

accuracy EoL

- 3

PCVM

ERR_E

OL_3

-2.0 – 2.0 mV

5)

3) 6)

1. 16-bit mode

2. 1 V ≤ ( V

Un+1

- V

Un

) ≤ 3.6 V

3. -40°C ≤  T

j

≤ 50°C

PRQ-1898

(table continues...)

TLE9009DQU

Li-ion battery monitoring and balancing IC

8 Primary cell voltage measurement (PCVM)

Datasheet 29 Rev. 1.0

2024-09-15

Page 30 of 73

Table 9 (continued) Electrical characteristics

V

VS

=  V

VS_functional

, T

j

= -40°C to +150°C, all voltages with respect to GND, positive current flowing into pin (unless

otherwise specified)

Parameter Symbol Values Unit Note or condition P-

Number

Min. Typ. Max.

PCVM

accuracy EoL

- 4

PCVM

ERR_E

OL_4

-2.1 – 2.1 mV

5)

3) 6)

1. 16-bit mode

2. 3.6 V < ( V

Un+1

- V

Un

) ≤ 4.3 V

3. -40°C ≤  T

j

≤ 50°C

PRQ-1899

PCVM

accuracy EoL

- 5

PCVM

ERR_E

OL_5

-2.6 – 2.6 mV

5)

3) 6)

1. 16-bit mode

2. 1 V ≤ ( V

Un+1

-  V

Un

) ≤ 3.6 V

3. -40°C ≤  T

j

≤ 150°C

PRQ-1900

PCVM

accuracy EoL

- 6

PCVM

ERR_E

OL_6

-2.8 – 2.8 mV

5)

3) 6)

1. 16-bit mode

2. 3.6 V < ( V

Un+1

- V

Un

) ≤ 4.3 V

3. -40°C ≤  T

j

≤ 150°C

PRQ-1901

PCVM

accuracy EoL

- 7

PCVM

ERR_E

OL_7

-2.6 – 2.6 mV

5)

3) 6)

1. 16-bit mode

2. 0.05 V ≤ ( V

Un+1

- V

Un

) ≤ 1 V

3. -40°C ≤   T

j

≤  150°C

PRQ-1902

PCVM

accuracy EoL

- 8

PCVM

ERR_E

OL_8

-3.5 – 3.5 mV

5)

3) 6)

1. 16-bit mode

2. 4.3 V < ( V

Un+1

- V

Un

) ≤ 4.8 V

3. -40°C ≤  T

j

≤ 150°C

PRQ-1903

PCVM

accuracy EoL

- 9

PCVM

ERR_E

OL_9

-2.6 – 2.6 mV

5)

3) 6)

1. 16-bit mode

2. 1 V < ( V

Un+1

-  V

Un

) ≤ 3.6 V

3. -40°C ≤  T

j

≤ 70°C

PRQ-1904

PCVM

accuracy EoL

- 10

PCVM

ERR_E

OL_10

-2.8 – 2.8 mV

5)

3) 6)

1. 16-bit mode

2. 3.6 V < ( V

Un+1

-  V

Un

) ≤ 4.3 V

3. -40°C ≤  T

j

≤ 70°C

PRQ-1905

PCVM

accuracy EoL

- 10-bit

PCVM

ERR_E

OL_10bit

-15 – 15 mV

3) 6)

1. 10-bit mode

2. 0.05 V ≤ ( V

Un+1

- V

Un

)

≤ 4.8 V

3. -40°C ≤   T

j

≤  150°C

PRQ-1881

1) Not subject to production test; verified by design or characterization.

2) Initial accuracy verified by Infineon backend.

3) With 9 cells attached and activated

4) Test condition: The IC is pre assembled on a PCB. A PCVM is started at any time t

0

within the device lifetime. The IC is in sleep

mode between t

0

and t

0+x

and RR_ERR_CNT.RR_SLEEP_CNT bitfield is 000

H

.

5) Lower resolution has additional quantization error e.g. additional  PCVM

ERR_EOL

± 2 LSB[m]; m bits: 14 ≤ m ≤ 15

TLE9009DQU

Li-ion battery monitoring and balancing IC

8 Primary cell voltage measurement (PCVM)

Datasheet 30 Rev. 1.0

2024-09-15

Page 31 of 73

Please contact Infineon for more details for other ADC resolutions.

6) End-of-Life (EoL) accuracy; according to AEC-Q100 Grade 1 Rev. H automotive qualification

TLE9009DQU

Li-ion battery monitoring and balancing IC

8 Primary cell voltage measurement (PCVM)

Datasheet 31 Rev. 1.0

2024-09-15

Page 32 of 73

9 Secondary cell voltage measurement (SCVM)

9.1 Functional description

The device includes a secondary cell voltage measurement (SCVM) unit. The measured voltage  V

SCVM

= ( V

Gn

-

V

Un

) (0 ≤ n ≤ 8) is measured with the accuracy  SCVM

ERR_EOL

and a resolution of V

SCVM_LSB

.

The secondary cell voltage measurement is initiated by setting the SCVM_START bitfield in the MEAS_CTRL

register. The secondary cell voltage is calculated using:  V

SCVM

[V] = ( FSR

SCVM

/ 2

11

) × RESULT[LSB11]

The SCVM unit can measure the voltage of at least one cell simultaneously with the primary cell voltage

measurement within  t

VM_prop

. At least one cell must be enabled in the SCVM configuration register. The

corresponding cells for SCVM must also be activated in the PART_CONFIG register.

Note: A binary search algorithm follows the highest and the lowest cell voltage of all cells enabled in the

SCVM_CONFIG register for each sample. Within the sampling time 1/f

s_SCVM_ADC

both voltages are sampled once.

The SCVM averages all samples of the lowest and all samples of the highest voltage over the entire measurement

time.

A 2-bit update counter in each SCVM register, SCVM lowest cell voltage and SCVM highest cell voltage, indicates

the availability of a new secondary cell voltage measurement.

After the measurement time, the SCVM needs additional time t

SCVM_ave

to calculate the average results. After

t

SCVM_ave

, the value of the highest voltage measured by the SCVM is stored in the SCVM highest cell voltage

register. The lowest voltage is stored in SCVM lowest cell voltage register, respectively.

Note: If a single cell is measured, then calculate the average of the two results registers to improve filtering.

9.2 Electrical characteristics secondary cell voltage measurement

(SCVM)

Table 10 Electrical characteristics

V

VS

=  V

VS_functional

,  T

j

= -40°C to +150°C, all voltages with respect to GND, positive current flowing into pin (unless

otherwise specified)

Parameter Symbol Values Unit Note or condition P-

Number

Min. Typ. Max.

Cell sensing inputs

SCVM

differential

input current

Gn

I

Gn_SCVM

– 7 10 μ A

1)

1. Average during SCVM

2. V

SCVM

= 5 V

3. This differential current flows into

Gn and has the opposite direction

on Un for channels 0 ≤ n ≤ 8

PRQ-1883

Input leakage

current Gn

I

Gn_leak

-1.0 – 1.0 μA 1. 0 ≤ n ≤ 8

2. In sleep mode and idle mode

3. V

Gn

≤ 5.5 V

PRQ-1884

Synchronization timing

SCVM to

PCVM time

deviation

Dev

SCVM_PC

VM

-0.5 – +0.5 % Within one IC, the maximum deviation

between SCVM (11-bit) time and PCVM (11-

bit) time.

PRQ-622

(table continues...)

TLE9009DQU

Li-ion battery monitoring and balancing IC

9 Secondary cell voltage measurement (SCVM)

Datasheet 32 Rev. 1.0

2024-09-15

Page 33 of 73

Table 10 (continued) Electrical characteristics

V

VS

=  V

VS_functional

,  T

j

= -40°C to +150°C, all voltages with respect to GND, positive current flowing into pin (unless

otherwise specified)

Parameter Symbol Values Unit Note or condition P-

Number

Min. Typ. Max.

SCVM data

averaging

time

t

SCVM_ave

286 298 311 μs   PRQ-1390

Secondary cell voltage measurement

SCVM ADC

sampling

frequency

f

s_SCVM_ADC

– f

s_ AD

C

/ 64

– MHz

2)

PRQ-625

SCVM

accuracy EoL

- limited

range

SCVM

ERR_E

OL_1

-19 – 19 mV

3)

1. 2.7 V ≤ ( V

Gn

- V

Un

) ≤ 4.3 V

2. -40°C ≤   T

j

≤  50°C

PRQ-626

SCVM

accuracy EoL

SCVM

ERR_E

OL_2

-28 – 28 mV

3)

1. 1 V ≤ ( V

Gn

- V

Un

) ≤ 4.8 V

2. -40°C ≤ T

j

≤ 150°C

PRQ-627

Maximum

deviation

between

PCVM and

SCVM

Δ

PCVM_vs_SCV

M

-25 – 25 mV 1 V ≤ ( V

Un+1

- V

Un

)  ≤ 4.8 V PRQ-1305

Analog undervoltage and overvoltage comparators

Comparator

resolution

FSRV

Comp_

LSB

– FSR

C

omp

/

2

10

– V

2)

PRQ-629

Comparator

accuracy -

limited range

COMP

ERR_1

-30 – 30 mV 1. ( V

Gn

- V

Un

) = 3.6 V

2. -40ºC ≤ T

j

≤ 25ºC

PRQ-1300

Comparator

accuracy

COMP

ERR_2

-50 – 50 mV 1. 1 V < ( V

Gn

- V

Un

) < 4.7 V

2. -40°C < T

j

< 150°C

PRQ-630

Comparator

sampling

frequency

f

COMP

1 – – MHz

2)

PRQ-632

Comparator

checking

time

t

comp

– 2

10

/

f

s_AD

C

– μs

2)

PRQ-635

1) Not subject to production test; verified by design or characterization.

2) Not subject to production test; verified by design or characterization.

3) End-of-Life accuracy; according to AEC-Q100 Grade 1 Rev. H automotive qualification

TLE9009DQU

Li-ion battery monitoring and balancing IC

9 Secondary cell voltage measurement (SCVM)

Datasheet 33 Rev. 1.0

2024-09-15

Page 34 of 73

10 Block voltage measurement (BVM)

10.1 Functional description

The IC can measure the sum total voltage of all the cells connected to the device using separate pins, called

block voltage. The block voltage V

BVM

= ( V

U9P

-  V

GND

) is measured with the accuracy BVM

ERR_EOL

and a

configurable resolution of V

BVM_LSB

.

The block voltage measurement is initiated by setting the BVM_START bitfield in the MEAS_CTRL register. The

block voltage is calculated:  V

BVM

[V] = ( FSR

BVM

/ 2

16

) × RESULT_BVM [LSB16]

10.2 Electrical characteristics block voltage measurement (BVM)

Table 11 Electrical characteristics

V

VS

= V

VS_functional

, T

j

= -40°C to +150°C, all voltages with respect to GND, positive current flowing into pin (unless

otherwise specified)

Parameter Symbol Values Unit Note or condition P-

Number

Min. Typ. Max.

Cell sense inputs

BVM input

current U9P

I

U9P_BVM

– 280 400 μA

1)

During BVM

PRQ-1886

Block voltage measurement

Maximum

BVM to PCVM

time

deviation

within IC

Dev

BVM_PCV

M_IC

-0.5 – +0.5 %

2)

Deviation between BVM t

VM

and PCVM

t

VM

with the same resolution setting.

PRQ-670

Maximum

BVM time

deviation

across ICs

Dev

BVM_cha

in

-4 – 4 %

2)

Deviation between BVM t

VM

over all ICs

with the same resolution setting.

PRQ-671

BVM

accuracy EoL

- 1

BVM

ERR_EO

L_1

-50 – 50 mV

3)

1. 14-bit to 16-bit mode

2. 4.75 V ≤  V

BVM

≤ 38.7 V

3. -40°C ≤  T

j

≤ 70°C

PRQ-1915

BVM

accuracy EoL

- 2

BVM

ERR_EO

L_2

-55 – 55 mV

3)

1. 14-bit to 16-bit mode

2. 4.75 V ≤  V

BVM

≤ 45 V

3. -40°C ≤  T

j

≤ 150°C

PRQ-1914

BVM

accuracy EoL

- 10 Bit

BVM

ERR_10

Bit

-250 – 110 mV

1)

3)

1. 10-bit mode

2. 4.75 V ≤  V

BVM

≤ 45 V

3. -40°C ≤   T

j

≤  150°C

PRQ-1916

(table continues...)

TLE9009DQU

Li-ion battery monitoring and balancing IC

10 Block voltage measurement (BVM)

Datasheet 34 Rev. 1.0

2024-09-15

Page 35 of 73

Table 11 (continued) Electrical characteristics

V

VS

= V

VS_functional

, T

j

= -40°C to +150°C, all voltages with respect to GND, positive current flowing into pin (unless

otherwise specified)

Parameter Symbol Values Unit Note or condition P-

Number

Min. Typ. Max.

BVM versus

sum of PCVM

relative

accuracy EoL

BVM

ERR_vs_

PCVM

BVM

E

RR_EO

L_2_m

in

+

9

×

PCV

M

ERR

_EOL_

6_min

– BVM

E

RR_EO

L_2_m

ax

+ 9

×

PCV

M

ERR

_EOL_

6_max

mV 14-bit to 16-bit mode PRQ-1917

Relative ADC

error margin

- sum of

PCVM versus

BVM EoL

ERR

PCVM_B

VM_10bit

-78 – 78 mV 1. 10-bit mode

2. -40°C ≤  T

j

≤ 150°C

3. 1 V ≤ ( V

Un+1

-  V

Un

) ≤ 4.8 V

4. Plausibility check as part of the

round robin scheme

PRQ-1851

1) Not subject to production test; verified by design or characterization.

2) Not subject to production test; verified by design or characterization.

3) End-of-Life accuracy; according to AEC-Q100 Grade 1 Rev. H automotive qualification

TLE9009DQU

Li-ion battery monitoring and balancing IC

10 Block voltage measurement (BVM)

Datasheet 35 Rev. 1.0

2024-09-15

Page 36 of 73

11 Auxiliary voltage measurement (AVM)

11.1 Functional description

The IC also provides the possibility to measure other voltages, called auxiliary voltage measurement. The

auxiliary voltage V

AVMz

=

( V

TMPz

-  V

TMP_GND

), (0 ≤ z ≤ 4) is measured with the accuracy  AVM

ERR_EOL

and a resolution

of  V

AVM_LSB

.

The auxiliary voltage measurement is initiated by setting the AVM_START bitfield in the MEAS_CTRL register.

The auxiliary voltage is calculated using:  V

AVMz

[V] = ( FSR

AVM

/ 2

10

) × RESULT [LSB10]

Additional to the unipolar AVM the device can be configured to measure a bipolar voltage applied on the

TMP3 and TMP4 pins instead. The voltage V

BAVM

= ( V

TMP4

- V

TMP3

) is measured with the accuracy BAVM

ERR_EOL

and a configurable resolution of V

BAVM_LSB

.

The BAVM measurement is enabled by setting the AVM_CONFIG.AUX_BIPOLAR bitfield, the resolution is set by

the MEAS_CTRL.BVM_MODE and the measurement is triggered by the MEAS_CTRL.BVM_START bit. The BAVM

measurement result is stored in the BVM result register.

The bipolar voltage is calculated using:  V

BAVM

= (BVM.RESULT[signed LSB15] × 2 V) / 2

15

[LSB15]

Note: Either BVM or BAVM can be performed synchronized to the PCVM/SCVM.

All external temperature measurement channels can be selected to be measured by the AVM function:

To measure an auxiliary voltage using a TMP channel, the temperature measurement function must be disabled

in the temperature measurement configuration register. Since only one auxiliary voltage can be measured at a

time, the configured auxiliary channels are measured sequentially.

11.2 Electrical characteristics auxiliary voltage measurement (AVM)

Table 12 Electrical characteristics

V

VS

= V

VS_functional

, T

j

= -40°C to +150°C, all voltages with respect to GND, positive current flowing into pin (unless

otherwise specified)

Parameter Symbol Values Unit Note or condition P-

Number

Min. Typ. Max.

AVM accuracy

EoL

AVM

ERR_EO

L

-10 – 10 mV

1)

1. 10-bit mode

2. 0.1 V ≤ V

AVMy

≤ 1.95 V

3. -40°C ≤   T

j

≤  150°C

PRQ-684

BAVM

accuracy EoL

BAVM

ERR_E

OL

-3.3 – 3.3 mV

1)

1. 14-bit to 16-bit mode

2. -2 V ≤  V TMP3/4 ≤ 2 V

3. -40°C ≤  T

j

≤ 150°C

PRQ-1389

BAVM

accuracy EoL

- long-

running

mode

BAVM

ERR_E

OL_LR

BAV

M

ERR

_EOL

-

14.7

– BAV

M

ERR

_EOL

+

14.7

mV 1. Long-running mode

2. -2 V ≤  V

TMP3/4

≤ 2 V

3. -40°C ≤   T

j

≤  150°C

PRQ-1829

1) End-of-Life accuracy; according to AEC-Q100 Grade 1 Rev. H automotive qualification

TLE9009DQU

Li-ion battery monitoring and balancing IC

11 Auxiliary voltage measurement (AVM)

Datasheet 36 Rev. 1.0

2024-09-15

Page 37 of 73

12 Temperature measurement unit (TMP)

12.1 Functional description

The temperature measurement unit provides the possibility to measure up to five external temperature NTCs as

well as two internal temperature sensors and provides the results in the corresponding temperature registers.

A valid bit, which is cleared after readout, indicates a new measurement result in both cases.

The NTCs are measured with an accuracy of  NTC

ERR

whilst the internal sensor accuracy is defined by  T

ERR_int_abs

.

TMP0

-

TMP4

I0

I1

I2 I3

NTC0 NTC4

I

TMP 0/2/4

EXT_TEMP_0.RESULT

EXT_TEMP_1.RESULT

EXT_TEMP_2.RESULT

EXT_TEMP_3.RESULT

EXT_TEMP_4.RESULT

13th SD-ADC

Optionally set via

TEMP_MUX_DIAG_SEL

bitfield

C

TMPz

R

PD_on

R

PD_on

TMP0

TMP1

TMP2

TMP3

TMP4

0

1 2

3

0

1

2

3

4

5

0

4

VDDA

I0: I

TMPz_0

I1: I

TMPz_1

I2: I

TMPz_2

I3: I

TMPz_3

R

DIAG_320

I0

I1

I2 I3

I

TMP 1/3

0

1 2

3

VDDA

Device

R

DIAG

R

TMPz

Optional

filter

R

DIAG

R

DIAG_5

EXT_TEMP_R_DIAG.RESULT

Automatic source selection to maximize ADC

resolution

I

TMPz_x

à I

TMPz_(x + 1)

if RESULT > TH

src_overflow

I

TMPz_x

à I

TMPz_(x - 1)

if RESULT < TH

src_underflow

Figure 7 External temperature measurement

If not all provided measurement channels are needed, unused channels must be deactivated in the

temperature configuration register.

Note: The TMP channels must be connected in consecutive order starting with TMP0. Deactivated channels can be

used as AVM inputs .

The internal temperature measurement as well as the measurement of the selected NTC channels are triggered

via the internal round robin. Within three round robin cycles all NTCs are updated.

Note: The first round robin after wake-up does not measure any NTC.

TLE9009DQU

Li-ion battery monitoring and balancing IC

12 Temperature measurement unit (TMP)

Datasheet 37 Rev. 1.0

2024-09-15

Page 38 of 73

t

RR

e.g. 50ms

t

settle TMP2/3

t

settle TMP1/0

t

settle TMP3/2

t

RR

e.g. 50ms

t

settle TMP0/1

t

RR

e.g. 50ms

Round Robin

NR_TEMP_SENSE = 100

B

NR_EXT_TEMP_START = 000

B

Alternating channel measurement order within round robin. Always first

measured channel used for further diagnosis checks (pull-down & R

DIAG

)

Figure 8 TMP triggering

To measure an external NTC, the device provides four selectable internal current sources  I

TMPz_x

(0 ≤ z ≤ 4, 0 ≤ x ≤

3). The device automatically identifies which one of the four sources is the best one to use in the next round

robin for each NTC channel individually by using the overflow and underflow thresholds TH

Src_overflow

and  TH

Src_underflow

.

Current source  I

TMPz_1

is selected first. If, for example, an overflow is detected, the next lower source is selected.

A valid result is available (or NTC short/open is detected)  after maximum three round robin cycles per activated

NTC channel.

Note: The source is activated prior to the measurement. The time is defined by t

settle

.

For every TMP channel, a result register is available. The results register contains the following information:

• The result of the measurement.

• The used current source.

• The valid bit is set to indicate a new measurement. Reading the result clears the valid bit.

• Whether the pull-down of this channel was activated.

• Whether a pull-down error occurred.

The NTC resistor value is calculated by using the voltage measurement result and the selected current source.

R

NTC

[ Ω ] = (EXT_TEMP_z.RESULT [LSB10] × FSR

TMP

[V] × 4

EXT_TEMP_z.INTC

) / (2

10

× 320 μA) - R

TMP

; INTC = 0 to 3

(used current source).

To check if the temperature measurement unit works correctly the IC performs internal diagnostics checks as

part of the round robin:

1. It measures an internal diagnostics resistor R

DIAG

with the current source  I

TMPz_x

(0 ≤ x ≤ 3, 0 ≤ z ≤ 4) used

for TMPz.

2. It activates the pull down switch of the selected TMP channel after the measurement and it measures

the channel again. The measured value is then compared with the expected value  R

PD_ON

. An open wire

or increased resistance value can be detected and is indicated by setting the GEN_DIAG.EXT_T_ERR

(external temperature error).

Note: Only one TMP channel is checked per RR cycle (channel that was measured first during RR). The pull down

resistor can be activated by setting the corresponding bits in the auxiliary voltage measurement configuration

register

The device checks whether an overtemperature condition at the NTC exists by comparing the voltage

measurement result against the external overtemperature threshold.

TLE9009DQU

Li-ion battery monitoring and balancing IC

12 Temperature measurement unit (TMP)

Datasheet 38 Rev. 1.0

2024-09-15

Page 39 of 73

The 10-bit overtemperature threshold is configurable with a resolution of V

TMP_LSB

using the external

overtemperature threshold bits of the temperature measurement configuration register

TEMP_CONF.EXT_OT_THR.

Note: In order to ensure the detection of an external overtemperature, the overtemperature threshold must be

defined within the range of 250 to 800 (LSB10).

The device additionally checks if an overtemperature condition on at least one of the internal temperature

sensors exists by comparing the measurement result against internal overtemperature threshold which is valid

for both sensors.

The 10-bit overtemperature threshold is configurable with a resolution of  T

int_LSB

using the internal

overtemperature threshold bits of the internal temperature measurement configuration register

INT_OT_WARN_CONF.INT_OT_THR (recommended value: T

j

= 150°C).

If the overtemperature threshold is reached, the device disables the balancing function and sets the internal

overtemperature warning flag.

The junction temperature T

j

can be calculated using the formula: Temperature [°C] = - T

int_LSB

×

INT_TEMP_x.RESULT + 547.3, (1 ≤ x ≤ 2)

12.2 Electrical characteristics temperature measurement (TMP)

Table 13 Electrical characteristics

V

VS

= V

VS_functional

, T

j

= -40°C to +150°C, all voltages with respect to GND, positive current flowing into pin (unless

otherwise specified)

Parameter Symbol Values Unit Note or condition P-

Number

Min. Typ. Max.

Internal temperature sensor

TMP internal

temperature

resolution

T

int_LSB

– 0.66

24

– K

1)

PRQ-787

TMP internal

temperature

accuracy EoL

absolute

T

ERR_int_abs

-10 – 10 °C – PRQ-788

External temperature sensors

TMP

measuremen

t resolution

V

TMP_LSB

– FSR

T

MP

/2

10

– V – PRQ-1303

TMP

measuremen

t accuracy - 1

TMP

ERR_1

-2 – 2 % Accuracy of measured NTC resistance

value in the range of 1.22 k Ω to 390 k Ω

PRQ-789

TMP

measuremen

t accuracy - 2

TMP

ERR_2

-4.2 – 4.2 % Accuracy of measured NTC resistance

value in the range of 610  Ω to 1.22 k Ω

PRQ-790

TMP

measuremen

t accuracy - 3

TMP

ERR_3

-6.2 – 6.2 % Accuracy of measured NTC resistance

value in the range of 400 Ω to 610  Ω

PRQ-791

(table continues...)

TLE9009DQU

Li-ion battery monitoring and balancing IC

12 Temperature measurement unit (TMP)

Datasheet 39 Rev. 1.0

2024-09-15

Page 40 of 73

Table 13 (continued) Electrical characteristics

V

VS

= V

VS_functional

, T

j

= -40°C to +150°C, all voltages with respect to GND, positive current flowing into pin (unless

otherwise specified)

Parameter Symbol Values Unit Note or condition P-

Number

Min. Typ. Max.

TMP pull-

down switch

on-state

resistance

R

PD_on

– – 400 Ω – PRQ-797

TMP source

selection

overflow

threshold

TH

src_overfl

ow

– 1000 – LSB10

1)

PRQ-803

TMP source

selection

underflow

threshold

TH

src_underf

low

– 200 – LSB10

1)

PRQ-804

TMP current

source

activation

before RR

starts

t

settle

38.4 40 41.8

+ t

vm

ms

1)

t

RR

>  t

settle

PRQ-777

TMP

measuremen

t current

source 3

I

TMPz_3

4.5 5 5.5 μ A 1. 0 ≤ z ≤ 4

2. Within FSR

TMP

PRQ-868

TMP

measuremen

t current

source 2

I

TMPz_2

19.0 20 21.1 μ A 1. 0 ≤ z ≤ 4

2. Within FSR

TMP

PRQ-869

TMP

measuremen

t current

source 1

I

TMPz_1

75.9 80 84.1 μ A 1. 0 ≤ z ≤ 4

2. Within FSR

TMP

PRQ-870

TMP

measuremen

t current

source 0

I

TMPz_0

304.

0

320 336.

0

μ A 1. 0 ≤ z ≤ 4

2. Within FSR

TMP

PRQ-871

TMP internal

diagnostics

resistor

source

0_320uA

R

DIAG_320

3.82

5

5.1 6.37

5

k Ω – PRQ-799

(table continues...)

TLE9009DQU

Li-ion battery monitoring and balancing IC

12 Temperature measurement unit (TMP)

Datasheet 40 Rev. 1.0

2024-09-15

Page 41 of 73

Table 13 (continued) Electrical characteristics

V

VS

= V

VS_functional

, T

j

= -40°C to +150°C, all voltages with respect to GND, positive current flowing into pin (unless

otherwise specified)

Parameter Symbol Values Unit Note or condition P-

Number

Min. Typ. Max.

TMP internal

diagnostics

resistor

source

1_80uA

R

DIAG_80

8.4 11.2 14 k Ω – PRQ-800

TMP internal

diagnostics

resistor

source

2_20uA

R

DIAG_20

19.8

75

26.5 33.1

25

k Ω – PRQ-801

TMP internal

diagnostics

resistor

source 3_5uA

R

DIAG_5

46.5 62 77.5 k Ω – PRQ-802

1) Not subject to production test; verified by design or characterization.

TLE9009DQU

Li-ion battery monitoring and balancing IC

12 Temperature measurement unit (TMP)

Datasheet 41 Rev. 1.0

2024-09-15

Page 42 of 73

13 Cell balancing (CB)

13.1 Functional description

The IC supports balancing of each cell in the cell stack individually in any combination including all channels in

parallel with a balancing current per cell of  I

BAL

.

Overview of balancing current for one cell:

V

cell0

C

F

R

F

R

F

R

BAL

C

FB

V

cell1

C

F

R

F

R

BAL

C

FB

V

cell2

C

F

R

F

R

BAL

C

FB

R

F

V

cell8

C

F

R

F

R

BAL

C

FB

U9

G8

U8

U0

G0

U1

G1

U2

G2

U3

R

F

U9P

GND

I

BAL

R

F

× I

BAL

Figure 9 Passive balancing

To activate cell balancing, the respective bit in the balancing settings register can bet set for each cell

individually.

If the PBOFF bit in the measurement control register is set, then the IC pauses balancing automatically. The

balancing is paused for the duration of a PCVM/SCVM/BVM measurement ( t

VM

+ t

VM_del

) so that the cell voltage

measurement is not corrupted by any ongoing balancing.

V

CELL

V

CELL

- I

BAL

× R

F

V

Un

-V

Un-1

t

VM_del

Voltage

Measurement

t

VM

Start Balancing

Command

Start Cell voltage

Measurement Command

Balancing ON

Balancing PAUSED

Balancing ON

Commands

from host controller

MEAS_CTRL.PBOFF ="1"

MEAS_CTRL.CVM_DEL = "1"

Figure 10 Balancing and cell voltage measurement

TLE9009DQU

Li-ion battery monitoring and balancing IC

13 Cell balancing (CB)

Datasheet 42 Rev. 1.0

2024-09-15

Page 43 of 73

The IC can balance each cell for an individual period of time, without necessary periodic WDOG

communication.

The individual time t

BAL

is compared to the balancing counter.  t

BAL

is defined by t

BAL_OFFn_LSB

with a maximum

interval defined by  t

BAL_OFFn_max

. The balancing of each cell is active until the balancing counter reaches the

cell individual threshold.

If the extended watchdog function is enabled and a write command to the communication watchdog register is

performed, then the balancing timer counter starts. The device deactivates time goal balancing as soon as the

counter reaches the individual threshold t

BAL

.

The IC supports a PWM balancing function with the period of t

RR

and a PWM step size of t

BAL_PWM_LSB

. The

function can be configured via the communication interfaces by the host controller. If balancing for one or more

cells is activated, then the device activates the balancing switch during the on-time of the PWM and deactivates

it during the off-time of the PWM. Other functions such as the voltage measurement and round robin task can

overrule the PWM balancing function.

V

CELL

V

CELL

- I

BAL

× R

F

V

Un

- V

Un-1

t

VM_del

Voltage

Measurement

t

VM

Set duty cycle

and start

balancing

Start Cell voltage

Measurement Command

balancing “on”

balancing “off”

balancing “on”

Commands

from host controller

MEAS_CTRL.PBOFF ="1"

MEAS_CTRL.CVM_DEL = "1"

t

RR

x × t

BAL_PWM_LSB

t

RR

x × t

BAL_PWM_LSB

balancing “off”

RR

t

RR

RR

balancing “on”

balancing

“off”

Figure 11 PWM balancing function

Balancing is available in PCVM/SCVM long-running mode. If the PBOFF bit is set, then the device pauses cell

balancing during the delay time of the measurement and during the measurement itself.

Note: Only if t

vm_del

+ t

vm_14bit

<  t

restart

.

In addition to the internal passive balancing function, the IC also supports the use of an external passive

balancing device. It is recommended to connect a PMOS logic level type device to the corresponding Gn pin as

an external balancing device.

TLE9009DQU

Li-ion battery monitoring and balancing IC

13 Cell balancing (CB)

Datasheet 43 Rev. 1.0

2024-09-15

Page 44 of 73

CELL

#8

CELL

#7

R

F

R

F

R

F

C

F

U9

G8

U8

G7

U7

Ref. A

ΔΣ ADC 16bit

Chan. #8

Ref. A

Chan. #7

ΔΣ ADC 16bit

U9P

C

FB

C

FB

CELL

#1

CELL

#0

R

F

R

F

G1

U1

G0

U0

Ref. A

ΔΣ ADC 16bit

Chan. #1

Ref. A

Chan. #0

ΔΣ ADC 16bit

R

B

GND

R

F

U2

Cell Supervision Circuit PCB

C

U9P

GND

C

F

C

F

R

F

C

FB

C

F

C

FB

C

EMC

C

EMC

C

EMC

C

EMC

C

EMC

C

EMC

C

EMC

R

BAL

R

B

R

BAL

R

B

R

BAL

R

B

R

BAL

R

OC/UC

R

OC/UC

R

OC/UC

R

OC/UC

R

OC/UC

R

OC/UC

in case of balancing

diagnosis needed

Sensing IC

R

U9P

Figure 12 External balancing device

The IC supports overcurrent and undercurrent diagnostics for the external balancing device, using an

additional resistor R

OC/UC

.

Note: For the calculation of the overcurrent and undercurrent thresholds the voltage drop I

BAL

× R

OC/UC

is used.

TLE9009DQU

Li-ion battery monitoring and balancing IC

13 Cell balancing (CB)

Datasheet 44 Rev. 1.0

2024-09-15

Page 45 of 73

13.2 Electrical characteristics cell balancing (CB)

Table 14 Electrical characteristics

V

VS

= V

VS_functional

, T

j

= -40°C to +150°C, all voltages with respect to GND, positive current flowing into pin (unless

otherwise specified)

Parameter Symbol Values Unit Note or condition P-

Number

Min. Typ. Max.

CB balancing

switch on-

state

resistance - 1

R

BAL_on_1

1.5 2.6 5.0 Ω 1. 1 V ≤ ( V

Un+1

- V

Un

)

≤ 5 V

2. I

BAL

≤ 150 mA

PRQ-643

CB balancing

switch on-

state

resistance - 2

R

BAL_on_2

1.6 2.8 5.6 Ω 1. 1 V ≤ ( V

Un+1

-  V

Un

)

≤ 5 V

2. 150 mA < I

BAL

≤ 200 mA

PRQ-1849

CB balancing

current

I

BAL

– – 200 mA 1 V ≤ ( V

Un+1

- V

Un

)

≤ 5 V PRQ-645

Passive balancing timer

CB Individual

balancing

time interval

step

t

BAL_OFFn_L

SB

7.24 7.54 7.85 min 1. 1 ≤ n ≤ 9

2. EXT_WD = 1

PRQ-1889

CB Individual

balancing

timer

maximum

interval

t

BAL_OFFn_

max

3.74 3.9 4.06 h 1. 1 ≤ n ≤ 9

2. EXT_WD = 1, no WDOG timeout

3. 5-bit counter

PRQ-1888

PWM balancing

CB balancing

PWM step

size

t

BAL_PWM_L

SB

– t

RR

/

8

– ms

1)

PRQ-1363

1) Not subject to production test; verified by design or characterization.

TLE9009DQU

Li-ion battery monitoring and balancing IC

13 Cell balancing (CB)

Datasheet 45 Rev. 1.0

2024-09-15

Page 46 of 73

14 Cell diagnostics (CD)

14.1 Functional description

The IC provides automatic open wire and open load detection for each wire connected to a cell. The device

performs the detection by a voltage measurement while sinking the current I

OL_DIAG

into the balancing pin

during a round robin cycle. It checks the odd channels in the first cycle and the even channels in the

subsequent cycle.

If the delta voltage (( V

Un+1

- V

Un

) before OL compared to ( V

Un+1

- V

U n

) during OL) is not between the minimum

and maximum open load threshold, then a failure is detected. The open wire and open load-

detection threshold can be configured with a resolution of OL

thr_LSB

until the maximum threshold of  OL

thr_max

is

reached using the cell voltage thresholds register.

Diagnostics Balancing

V

celln

C

F

R

F

C

FB

OL_DIAG

BAL_ON

Un+1

Gn

Un

R

F

V

OL_THR

R

BAL

I

OL_DIAG

Broken wire

Figure 13 Open wire and open load diagnostics detection schematic

If the device detects an open wire or open load, then it indicates it in the corresponding bitfield of the

diagnostics open load register as well as in the open load error bit of the general diagnostic register.

t

VM_del

+ t

VM

U

X

- U

X-1

OL_THR_MIN

OL_THR_MAX

V

CELL

Odd Cells OL diag

t

VM_del

+ t

VM

U

Y

- U

Y-1

V

CELL

I

OL_diag

× R

F

Even channels

Odd channels

Even Cells OL diag

t

VM_del

+ t

VM

Block (BVM)

Cells (PCVM 10Bit)

OL_THR _MIN

OL_THR _MAX

t

VM

t

VM_del

t

VM

I

OL_diag

× R

F

Odd PCVM (10Bit)

Even PCVM (10Bit)

t

VM_del

t

VM_del

Figure 14 Open wire and open load diagnostics detection process

TLE9009DQU

Li-ion battery monitoring and balancing IC

14 Cell diagnostics (CD)

Datasheet 46 Rev. 1.0

2024-09-15

Page 47 of 73

For OL_THR_MIN=0, no OL error is detected if the cell voltage is not decreased during activated OL current.

For OL_THR_MAX=0, no OL error is detected if the cell voltage is decreased more than the value in the

OL_THR_MAX register.

As part of the round robin the device performs a balancing overcurrent and an undercurrent check for each cell

for which the balancing function is active. The overcurrent threshold  OC

thr

and the undercurrent threshold

UC

thr

is configurable with a resolution of  CD

thr_LSB

until the maximum threshold of  OC

thr_max

or

UC

thr_max

respectively is reached using the balancing current threshold register.

If the device detects an balancing overcurrent or balancing undercurrent error, then it deactivates balancing. It

reports error details in the BAL_DIAG_OC/BAL_DIAG_UC result register and summarized in the

GEN_DIAG.BAL_ERR_OC/BAL_ERR_UC bitfields.

By setting the configuration bit OP_MODE.I_DIAG_EN, the device discharges all configured channels with the

diagnostics current I

OL_DIAG

regardless of the BAL_SETTINGS register and independent of round robin.

14.2 Electrical characteristics cell diagnostics (CD)

Table 15 Electrical characteristics

V

VS

= V

VS_functional

, T

j

= -40°C to +150°C, all voltages with respect to GND, positive current flowing into pin (unless

otherwise specified)

Parameter Symbol Values Unit Note or condition P-

Number

Min. Typ. Max.

Open load

CD sink

current for

open load

detection

I

OL_DIAG

10 15 18.3 mA 0.75 V < ( V

Gn

- V

Un

)

< 5 V PRQ-650

CD open load

threshold

resolution

OL

thr_LSB

– 19.5 – mV

1)

PRQ-652

CD open load

threshold

maximum

value

OL

thr_max

– 1.23 – V

1)

PRQ-651

Overcurrent & undercurrent

CD balancing

overcurrent

or

undercurrent

error

threshold

resolution

CD

thr_LSB

– 19.5 – mV

1)

PRQ-655

CD maximum

balancing

overcurrent

error

threshold

OC

thr_max

– 4.98 – V

1)

1. OC_thr

= overcurrent threshold

2. I

OC_thr

= OC_THR [V] /  R

F

PRQ-653

(table continues...)

TLE9009DQU

Li-ion battery monitoring and balancing IC

14 Cell diagnostics (CD)

Datasheet 47 Rev. 1.0

2024-09-15

Page 48 of 73

Table 15 (continued) Electrical characteristics

V

VS

= V

VS_functional

, T

j

= -40°C to +150°C, all voltages with respect to GND, positive current flowing into pin (unless

otherwise specified)

Parameter Symbol Values Unit Note or condition P-

Number

Min. Typ. Max.

CD maximum

balancing

undercurrent

error

threshold

UC

thr_max

– 4.98 – V

1)

1. UC_thr

= undercurrent threshold

2. I

UC_thr

= UC_THR [V] /  R

F

PRQ-654

CD balancing

overcurrent

detection

time

t

BAL_OC_DET

– – t

RR_

max

ms

1)

Equivalent to maximum round robin cycle

time if the error counter is disabled (which

is the default value, M_NR_ERR_BAL_OC =

1)

PRQ-646

1)

Not subject to production test; verified by design or characterization.

TLE9009DQU

Li-ion battery monitoring and balancing IC

14 Cell diagnostics (CD)

Datasheet 48 Rev. 1.0

2024-09-15

Page 49 of 73

15 General-purpose input/output (GPIO/PWM)

15.1 Functional description

The device provides individual GPIOq/PWMp (0 ≤ q ≤ 1, 0 ≤ p ≤ 1) pins which can be used for digital input

or digital output.

After receiving a wake-up signal via iso UART, GPIOq can be used as GPIOs. A wake-up signal via UART sets the

GPIOq pins to act as interface pins.

PWMp can be used as GPIO or be configured to act as PWM unit.

PWMp can be configured to act as PWM outputs using the GPIO register.

The period  T

PWM

and the duty cycle  D

PWM

can be configured with their respective resolution  T

PWM_LSB

and  D

PWM_LSB

.

15.2 Electrical characteristics general-purpose input/output (GPIO/PWM)

Table 16 Electrical characteristics

V

VS

= V

VS_functional

, T

j

= -40°C to +150°C, all voltages with respect to GND, positive current flowing into pin (unless

otherwise specified)

Parameter Symbol Values Unit Note or condition P-

Number

Min. Typ. Max.

GPIO/PWM

period

resolution

T

PWM_LSB

– 2 – μs Bitfield with 5 bits. PRQ-1338

GPIO/PWM

duty cycle

resolution

D

PWM_LSB

– 3.57 – % 1. Bitfield with 5 bits.

2. 100% DC = 11100

B

PRQ-1339

GPIO/PWM

input "low"

level

V

GPIOq_low

V

PWMp_low

0 – V

VIO

× 0.3

V 1. 0 ≤ q ≤ 1

2. 0 ≤ p ≤ 1

PRQ-1393

GPIO/PWM

input "high"

level

V

GPIOq_high

V

PWMp_high

V

VIO

× 0.7

– V

VIO

V 1. 0 ≤ q ≤ 1

2. 0 ≤ p ≤ 1

PRQ-825

GPIO/PWM

output "low"

level

V

GPIOq_low

V

PWMp_low

0 – 0.45 V 1. I

GPIO

≤ 5 mA

2. 0 ≤ q ≤ 1

3. 0 ≤ p ≤ 1

PRQ-826

GPIO/PWM

output high

level

V

GPIOq_high

V

PWMp_high

V

VIO

-

0.45

– V

VIO

V 1. I

GPIO

≥ -5 mA

2. 0 ≤ q ≤ 1

3. 0 ≤ p ≤ 1

PRQ-827

GPIO/PWM

output

current

I

GPIOq

I

PWMp

-5 – 5 mA 1. Current capability of GPIO/PWM

output

2. 0 ≤ q ≤ 1

3. 0 ≤ p ≤ 1

PRQ-829

(table continues...)

TLE9009DQU

Li-ion battery monitoring and balancing IC

15 General-purpose input/output (GPIO/PWM)

Datasheet 49 Rev. 1.0

2024-09-15

Page 50 of 73

Table 16 (continued) Electrical characteristics

V

VS

= V

VS_functional

, T

j

= -40°C to +150°C, all voltages with respect to GND, positive current flowing into pin (unless

otherwise specified)

Parameter Symbol Values Unit Note or condition P-

Number

Min. Typ. Max.

External

capacitance

on GPIOq/

PWMp

C

GPIOq

C

PWMp

– – 30 pF

1)

1. 0 ≤ q ≤ 1

2. 0 ≤ p ≤ 1

PRQ-830

1) Not subject to production test; verified by design or characterization.

TLE9009DQU

Li-ion battery monitoring and balancing IC

15 General-purpose input/output (GPIO/PWM)

Datasheet 50 Rev. 1.0

2024-09-15

Page 51 of 73

16 Communication

16.1 Functional description

The device supports the following communication interfaces.

1. UART

2. iso UART

iso UART communications allows to stack multiple devices.

The device can be used in different configurations:

• Direct connection via UART, for low voltage applications

• Primary on bottom (PoB) communication with EMM function

• Primary on top (PoT) communication with EMM function

• Ring communication with EMM function

Battery

Stack

transformer

transformer

Normal Communication: RING mode

Sensing IC

CSC

Sensing IC

CSC

Sensing IC

CSC

Sensing IC

CSC

HV+

HV-

Sensing IC

CSC

IFH

IFL

IFH

IFL

IFH

IFL

IFH

IFL

IFH

UART

microcontroller

(Comm.)

Host Controller

Transceiver

IC

IFL

IFH

Sensing IC

CSC

Battery

Stack

Sensing IC

CSC

Sensing IC

CSC

Sensing IC

CSC

HV+

HV-

Sensing IC

CSC

Normal Communication: PoT

IFH

IFL

IFH

IFL

IFH

IFL

IFH

IFL

IFH

UART

microcontroller

(Comm.)

Host Controller

Transceiver

IC

transformer

IFL

Sensing IC

CSC

Battery

Stack

Sensing IC

CSC

Sensing IC

CSC

Sensing IC

CSC

HV+

HV-

UART

microcontroller

(Comm.)

Host Controller

Transceiver

IC

Sensing IC

CSC

transformer

Normal Communication: PoB

IFH

IFL

IFL

IFH

IFL

IFH

IFL

IFH

IFL

IFH

Figure 15 Communication configurations

The IC communication direction is determined during a wake-up cycle. The device configures the iso UART

interface or the UART interface, which receives the wake-up pattern, as RX. The device configures the other

interface as TX. To change the direction and consequently the pins, the device must be put to sleep and woken

up again.

There is a reply delay  t

reply_delay

, which determines the time between the last stop bit of the read/write

command (incoming command from the primary) and the first falling edge of the reply frame from the

secondary.

The device forwards a received message to the next device in the system. The time between receiving and

forwarding the message depends upon the receiving interface:

• Receiving on UART and forwarding on iso UART:  t

UART_isoU_del

• Receiving on iso UART and forwarding on iso UART:  t

isoU_prop_del

• Receiving on iso UART and forwarding on UART:  t

UART_isoU_del

TLE9009DQU

Li-ion battery monitoring and balancing IC

16 Communication

Datasheet 51 Rev. 1.0

2024-09-15

Page 52 of 73

READ request for IC_#3 (40bits)

BMS_IC_#1

microcontroller

Transceiver

BMS_IC_#2

BMS_IC_#3

BMS_IC_#4

t

reply_delay

Pass through delay

t

isoUART_prop_del

REPLY IC_#3 (50Bits)

READ request for IC_#3 (40bits)

READ request for IC_#3 (40bits)

READ request for IC_#3 (40bits)

READ request for IC_#3 (40bits)

READ request for IC_#3 (40bits) REPLY IC_#3 (50Bits)

REPLY IC_#3 (50Bits)

REPLY IC_#3 (50Bits)

REPLY IC_#3 (50Bits)

Pass through delay

t

isoUART_prop_del

IFL IFH

UART

UART

IFL

IFH

IFL

IFH

IFL

IFH

IFL

IFH

Assuming 4 secondaries with PoB configuration, communication with BMS_IC_#3

Ring Mode (dotted lines)

REPLY IC_#3 (50Bits)

Figure 16 Communication propagation delays

iso UART waveform specification

0.001

0.002

0.003

0.004

0.005

0.006

0.007

0.008

0.009

1.00E-08 2.00E-08 3.00E-08 4.00E-08 5.00E-08 6.00E-08 7.00E-08 8.00E-08 9.00E-08 1.00E-07

i

od

in A

t

pulse

in s

Overdrive current

Pulse correctly detected

Pulse not detected

Figure 17 iso UART waveform specification

TLE9009DQU

Li-ion battery monitoring and balancing IC

16 Communication

Datasheet 52 Rev. 1.0

2024-09-15

Page 53 of 73

16.1.1 Register write modes

There are the following approaches for writing content into the device:

• Direct write: Writes a single register in a single device.

• Broadcast write: Writes a single register in all devices in the same stack with one write command.

With broadcast write, each device of the chain first writes data. On successful write it switches its RX and TX

units to allow the reply frame to be transferred. The last device in the chain (final node) initiates the reply

frame and the device switch their RX and TX units back to their initial state.

16.1.2 Communication frames

UART and iso UART communication consists of sending or retrieving sets of frames. A frame consists of 8 bits

preceded by a start bit and followed by a stop bit.

The following frames are available:

• Synchronization frame

• ID frame

• Address frame

• Data frames

• CRC frame

• Reply frame

Note: Frames start with the most significant bit (MSB).

Synchronization frame

The communication is always initiated by sending a fixed synchronization frame.

Sync frame

1 0 1 1 1 1 0 0 0 0

Start Bit

Stop Bit

MSB

Figure 18 Synchronization frame

ID frame

The ID frame defines, which device receives the message. It also determines the type of command.

ID[5:0]

1 x x x x x x 0 0 x

ID frame

W/R

Start Bit

Stop Bit

MSB

Figure 19 ID frame

Table 17 Bit assignment ID frame

ID frame bits Function

W/R[7] 1: Write command

0: Read command

ID[5:0] 000000: Default

x: ID

111111: Broadcast command

TLE9009DQU

Li-ion battery monitoring and balancing IC

16 Communication

Datasheet 53 Rev. 1.0

2024-09-15

Page 54 of 73

Note: The ID 00

H

is only available after reset, before enumeration. The ID 3F

H

is exclusively used for broadcast

commands.

Address frame

The address frame determines which register is affected by the read or write command.

Addr[7:0]

1 x x x x x x 0 x x

Address frame

Start Bit

Stop Bit

MSB

Figure 20 Address frame

Data frame

The data frame contains the sent or retrieved data.

Data[15:8]

1 x x x x x x 0 x x

Data frame #2

Data[7:0]

1 x x x x x x 0 x x

Data frame #1

Start Bit Stop Bit

MSB

Figure 21 Data frames

CRC frame

For read and write commands, an 8-bit CRC protection conforming to SAE J1850 for the entire message

including the synchronization frame is calculated and appended to the frames.

8-bit polynomial: G(z) = z

8

+ z

4

+ z

3

+ z

2

+ 1 (initial value = FF

H

; XOR value = FF

H

)

CRC[7:0]

1 x x x x x x 0 x x

CRC frame

Start Bit

Stop Bit

MSB

Figure 22 CRC frame

Note: If the device encounters an invalid CRC, it neither accepts the message nor replies to it.

Reply frame

The device acknowledges a received write command with a reply frame. In case of a broadcast write command

only the last device in the chain generates the reply frame.

Status

1 x x x x x x 0 x x

Reply frame

Start Bit

Stop Bit

Res

CRC

MSB

Figure 23 Reply frame

The message reply frame is protected by a 3-bit CRC calculated as: G(z) = z

3

+ z +1.

TLE9009DQU

Li-ion battery monitoring and balancing IC

16 Communication

Datasheet 54 Rev. 1.0

2024-09-15

Page 55 of 73

Table 18 Bit assignment reply frame

Reply-Frame Function

bit[7:6] Res [1:0] Reserved

bit[5] Status [2] 0: Write command successfully transmitted

1: CRC checked register error

bit[4] Status [1] 0: Register address for write command valid

1: Register address for write command invalid

bit[3] Status [0] 0: No fault in general diagnostics register

1: Fault in general diagnostics register

bit[2:0] CRC [2:0] 3-bit reply CRC

16.1.3 Register read modes

There are the following approaches for reading content from the device:

• Direct read: Read a single register from a single IC.

• Broadcast read: Read a single register from all ICs in the same stack with one read command.

• Multi read: Read multiple registers from a single IC. The read command for multiple registers is

configurable in the multi read register MULTI_READ_CFG and can read the following measurement results

with one read command of the MULTI_READ register:

- PCVM

- BVM

- SCVM

- External temperature measurement

- Internal temperature measurement

- R

DIAG

measurement

16.2 Electrical characteristics communication

Table 19 Electrical characteristics

V

VS

= V

VS_functional

, T

j

= -40°C to +150°C, all voltages with respect to GND, positive current flowing into pin (unless

otherwise specified)

Parameter Symbol Values Unit Note or condition P-

Number

Min. Typ. Max.

GPIO/PWM physical layer

UART to iso

UART

propagation

delay

t

UART_isoU_

del

– 25 60 ns Propagation delay from UART to iso UART PRQ-828

GPIO bit rate BR

GPIO

0.97 2 2.1 Mbit/s – PRQ-831

UART

broadcast

read bus

release time

t

UART_rel_BR

– – 15 ×

1/

BR

GP

IO

s Time to wait before sending a new

command after end of broadcast read

reply

PRQ-1909

(table continues...)

TLE9009DQU

Li-ion battery monitoring and balancing IC

16 Communication

Datasheet 55 Rev. 1.0

2024-09-15

Page 56 of 73

Table 19 (continued) Electrical characteristics

V

VS

= V

VS_functional

, T

j

= -40°C to +150°C, all voltages with respect to GND, positive current flowing into pin (unless

otherwise specified)

Parameter Symbol Values Unit Note or condition P-

Number

Min. Typ. Max.

UART read,

write,

broadcast

write,

multiread

release time

t

UART_rel

– – 3 ×

1/

BR

GP

IO

s Time to wait before sending a new

command after end of read/write/

broadcast write/multiread reply

PRQ-1910

iso UART physical layer

iso UART

current

threshold

"high"

I

isoU_th_high

2.25 4.5 6.5 mA (I

IFx_H

-  I

IFx_L

) / 2

I

IFx_H

: Current in the iso UART high pin

I

IFx_L

: Current in the iso UART low pin

PRQ-832

iso UART

current

threshold

"low"

I

isoU_th_low

-6.5 -4.5 -2.25 mA (I

IFx_H

-  I

IFx_L

) / 2

I

IFx_H

: Current in the iso UART high pin

I

IFx_L

: Current in the iso UART low pin

PRQ-833

iso UART

propagation

delay

t

isoU_prop_d

el

– 25 70 ns

1)

Propagation delay from IFH to IFL and IFL

to IFH

PRQ-834

iso UART

overdrive

current

I

od

3 – – mA

2)

with  t

pulse

= 38 ns

PRQ-1370

Reply delay

time

t

reply_delay

0 1.7 3 μ s

2)

internal reply delay time of one IC

PRQ-837

iso UART bit

rate

BR

isoU

0.97 2 2.1 Mbit/s – PRQ-838

Series

resistor value

R

ser

37.0

5

39 40.9

5

Ω

2)

3)

PRQ-836

Series

capacitor

value

C

ser

0.95 1 1.05 nF

2)

3)

PRQ-835

Transceiver

Ron @100mA

R

ON

19 22 27 Ω – PRQ-1845

1) Tested with standard external circuit ( C

ser

, R

ser

).

2) Not subject to production test; verified by design or characterization.

3) External RC network needs to be adjusted depending on the application constraints, for example cable length.

TLE9009DQU

Li-ion battery monitoring and balancing IC

16 Communication

Datasheet 56 Rev. 1.0

2024-09-15

Page 57 of 73

17 Round robin (RR)

17.1 Functional description

The device automatically performs a round robin (RR) scheme, which triggers several measurements as well as

internal diagnostics to check for possible faults independently of any communication commands.

The setting of the partition configuration register determines, which cells are measured and diagnosed.

Note: To manually start a round robin cycle, use the RR_CONFIG.RR_SYNC bitfield and then perform a write

command to WD_CNT.

The automatic round robin diagnostic cycle is performed periodically every t

RR

. The period is configurable from

t

RR_min

to

t

RR_max

with a resolution of  t

RR_LSB

.

The duration of the actual diagnostic checks is defined by  t

RR_duration

. Note: The first round robin cycle is

performed immediately  after each IC wake-up. If the WD_CNT command is missing or delayed for > t

RR

, then in

RR_SYNC mode the RR is performed automatically after t

RR

.

The IC wakes up periodically from sleep mode to perform one RR cycle on a programmable periodical

basis with an interval t

RR_sleep

from t

RR_sleep_min

to t

RR_sleep_max

with a resolution of t

RR_sleep_LSB

. If the number of

NTCs is > 0, then two RR schemes are executed after wake-up before the IC returns to sleep mode.

RR RR RR RR RR

t

RR

RR

RR

t

RR_sleep

t

RR

t

RR

t

RR

Normal Mode

Sleep Mode

RR

RR

Figure 24 Round robin diagnostics timing during sleep mode

The following measurements are performed once during one round robin cycle in the following sequence:

1. Temperature measurements of both internal temperature sensors

2. ADC stress sensor compensation measurements and calculation

3. PCVM (10-bit) for all activated cells

4. BVM (10-bit)

5. NTC resistance measurement

6. NTC diagnostic measurements

Note: To measure all connected NTCs up to three cycles might be needed. The result registers of PCVM and BVM are

not updated.

During a round robin the following checks are performed subsequent to the corresponding measurements, if

set active.

1. Internal overtemperature check

2. The sum of all PCVMs is compared to the block voltage for a plausibility check

3. Cell voltage overvoltage and undervoltage check. If the voltage of a cell violates the programmed

threshold (identified either by the digital or the analog comparator)

4. Open load diagnostic for all voltage sensing and balancing pins

5. Balancing overcurrent and undercurrent check for each cell where the balancing function is active

6. NTC overtemperature check

7. NTC diagnostics checks

Each fault detected in a RR check increases the respective error counter by 1.

TLE9009DQU

Li-ion battery monitoring and balancing IC

17 Round robin (RR)

Datasheet 57 Rev. 1.0

2024-09-15

Page 58 of 73

Internal

temperature

meas. 2 (10Bit)

delay

BVM (10Bit)

PCVM (10Bit)

delay

OL ODD PCVM

(10Bit)

delay

OL EVEN PCVM

(10Bit)

delay

Bal. OC/UC

ODD PCVM

(10Bit)

delay

Bal. OC/UC

EVEN PCVM

(10Bit)

Compensation measurements

Comparator

OV/UV check

t

VM_del

t

VM

t

VM_del

t

VM

t

VM_del

t

VM

t

VM_del

t

VM

t

VM_del

t

VM

t

VM

t

comp

OL diag. check

EVEN channels

&

TMPy current

source selection

&

TMPy Sc/Oc/OT

1

checks

OV/UV check &

ADC error check

Bal. OC/UC diag.

check EVEN channels

&

TMPx used current

source RDIAG meas.

Bal. OC/UC diag. only performed

for channels with balancing state

ON in BAL_SETTINGS register

Internal temp. 2

OT check

t

RR_duration

OL diag. check

ODD channels

&

TMPx current

source selection

&

TMPx Sc/Oc/OT

1

checks

Bal. OC/UC diag.

check ODD channels

&

TMPx pull-down

diagnosis check

TMPx

TMPy

1

Sc/Oc/OT =short circuit / open circuit / over temperature

TMPx pull-

down check

TMPx used

source RDIAG

meas.

Internal

temperature

meas. 1 (10Bit)

t

VM

Internal temp. 1

OT check

Figure 25 RR task timing diagram

During a round robin cycle, the connections on the activated TMPz channels are checked for open or short

conditions. If it detects an open or short failure, then the corresponding fault bit in the external

overtemperature warning register is set. Additionally, the external temperature error bit of the general

diagnostics register is set. If the measured NTC value violates the corresponding thresholds, then an error flag is

set.

NTC_open

thr

≤ EXT_TEMP_z.RESULT

≤ NTC_short

thr

Clearing the external temperature error bit of the general diagnostics register resets the external

overtemperature warning register.

Note: RR_ERR_CNT.NR_EXT_TEMP_START bitfields setting and the current source range selection

impacts the number of RRs needed to detect a failure condition.

If the device detects an error during a round robin cycle, the individual error counter is increased by one. If the

error counter is greater than n

ERROR

, the respective error bit is set. The counter limit  n

ERROR

(3-bit) is

configurable and valid for all counters. It is possible to deactivate a specific error counter by setting a mask bit.

Note: Setting n

ERROR

to 0, sets the error flag with the first detection of the failure condition.

The status of the diagnostics registers which have been updated during a round robin cycle can be read via a

command. If a fault was detected, the information is latched and can be cleared via a clear command.

Note: The following diagnostics registers are available:

• General diagnosis GEN_DIAG

• Cell voltage supervision warning flag CELL_UV

• Cell voltage supervision warning flag CELL_OV

• External overtemperature warning flags EXT_TEMP_DIAG

• Diagnosis OPENLOAD DIAG_OL

• Cell voltage supervision warning flags CELL_UV_DAC_COMP

• Cell voltage supervision warning flags CELL_OV_DAC_COMP

• Passive balancing diagnosis OVERCURRENT BAL_DIAG_OC (only if balancing function is active)

• Passive balancing diagnosis UNDERCURRENT BAL_DIAG_UC (only if balancing function is active)

The IC keeps the diagnostic results (except for BAL_DIAG_OC and BAL_DIAG_UC) in sleep mode, as long as the

sleep mode supply is available on U9P pin. In sleep mode, the IC resets the passive balancing diagnostic

registers for overcurrent BAL_DIAG_OC and undercurrent BAL_DIAG_UC.

After the 10-bit cell voltage measurement task in the round robin cycle, the measurement results are compared

to configurable undervoltage and overvoltage thresholds. To configure the thresholds, the corresponding bits

in the cell voltage thresholds registers can be set with a resolution of  V

Comp_LSB

.

The undervoltage detection is disabled in case of UV_THR = 000

H

.

The overvoltage detection is disabled in case of OV_THR = 3FF

H

.

The IC has an automatic overvoltage and undervoltage detection. The comparator monitors the V

Gn

-

V

Un

voltage and sets the OV/UV bits in the registers CELL_UV_DAC_COMP and CELL_OV_DAC_COMP.

The delta sigma ADC monitors the ( V

Un+1

- V

Un

) voltage and sets the OV/UV bits in the registers.

TLE9009DQU

Li-ion battery monitoring and balancing IC

17 Round robin (RR)

Datasheet 58 Rev. 1.0

2024-09-15

Page 59 of 73

In a round robin cycle, the balancing function is paused during overvoltage and undervoltage check.

If the RR_SYNC bit is set, then the IC synchronizes the start of the round robin cycle to the watchdog command.

If this bit is set, then the next round robin cycle is triggered every time the watchdog WD_CNT is served.

Additionally, the round robin counter is reset.

Note: Autonomous RR is active if t

RR

expires before WD_CNT command arrives. This mechanism can synchronize all

devices in the chain as well as the round robin to other tasks.

After triggering a PCVM, SCVM, BVM, or AVM, the IC performs that measurement and terminates the round robin

(case 3). The GEN_DIAG.LOCK_MEAS bit is set to 1 in this case and it is not possible to start a second manual

measurement since RR cannot be skipped a second time, see cases 2, 3 and 4 in Figure.  After the measurement

is finished, the round robin task is restarted.

The round robin cycle has a lower priority than the triggered measurement.

Note: This is also true for a long running mode measurement.

TLE9009DQU

Li-ion battery monitoring and balancing IC

17 Round robin (RR)

Datasheet 59 Rev. 1.0

2024-09-15

Page 60 of 73

RR

CVM_DEL

(option)

RR

t

RR_duration

t

RR_duration

t

VM_del

+ t

VM

+ t

SCVM_ave

PCVM/SCVM/BVM

start meas. cmd

PCVM start bit

BVM start bit

Lock meas. bit

1

RR_CNT

RR

CVM_DEL

(option)

t

RR_duration

t

VM_del

+ t

VM

+ t

SCVM_ave

PCVM/SCVM/BVM

start meas. cmd

PCVM start bit

BVM start bit

Lock meas. bit

2

No clash between

RR and PCVM/

BVM/SCVM

RR delayed since

PCVM/BVM/SCVM

has priority

2nd PCVM/SCVM/

BVM start meas. cmd

(ignored!)

RR

RR

t

RR_duration

t

VM_del

+ t

VM

+ t

SCVM_ave

PCVM/SCVM/BVM

start meas. cmd

PCVM start bit

BVM start bit

Lock meas. bit

3

RR terminated since PCVM/

BVM/SCVM has priority. RR

new start subsequently

PCVM

SCVM start bit

SCVM

BVM

PCVM

SCVM

BVM

RR

SCVM start bit

PCVM

SCVM

BVM

CVM_DEL

(option)

SCVM start bit

RR

RR

t

RR_duration

t

VM_del

+ t

VM

+ 7* t

restart

+ t

SCVM_ave

PCVM/SCVM/BVM

start meas. cmd

PCVM start bit

BVM start bit

Lock meas. bit

4

PCVM/BVM/SCVM has

priority (also valid for PCVM/

BVM/SCVM long running

mode)

PCVM LR

SCVM LR _

BVM

CVM_DEL

(option)

SCVM start bit

t

SCVM_ave

t

SCVM_ave

t

SCVM_ave

t

SCVM_ave

2nd PCVM/SCVM/

BVM start meas. cmd

(ignored!)

2nd PCVM/SCVM/

BVM start meas. cmd

(ignored!)

Figure 26 Prioritizing PCVM, SCVM, BVM, and AVM versus round robin

If a round robin is delayed by a manually triggered measurement, then the device synchronizes the subsequent

RR scheme to start at the end of the measurement time t

vm

.

TLE9009DQU

Li-ion battery monitoring and balancing IC

17 Round robin (RR)

Datasheet 60 Rev. 1.0

2024-09-15

Page 61 of 73

Internal IC data, such as ADC trimming values is ECC protected and a register CRC check as well as an internal

data check is executed with a fixed hardware cycle time t

CRC_check

independent of the round robin scheme

interval time t

RR

. The registers with the following addresses are CRC protected: 01

H

, 02

H

, 03

H

, 04

H

, 05

H

, 08

H

, 09

H

,

0A

H

, 14

H

, 15

H

, 17

H

, 36

H

, 38

H

, 3A

H

, 3E

H

.

Note: The register CRC error as well as the internal IC error do not have an error counter.

17.2 Electrical characteristics round robin (RR)

Table 20 Electrical characteristics

V

VS

= V

VS_functional

, T

j

= -40°C to +150°C, all voltages with respect to GND, positive current flowing into pin (unless

otherwise specified)

Parameter Symbol Values Unit Note or condition P-

Number

Min. Typ. Max.

Overvoltage and undervoltage detection

OV/UV

threshold

resolution

V

OVUV_LSB

– FSR

P

CVM

/

2

10

– mV

1)

PRQ-766

OV/UV

threshold

maximum

value

V

OVUV_max

0 – FSR

P

CVM

V

1)

PRQ-767

Round robin counter

RR scheme

duration

t

RR_duration

– – 1.2 ms

1)

Only valid if the measurement delay

time  t

VM_del

is not higher than t

VM_del_LSB

.

PRQ-774

RR interval

step

t

RR_LSB

1.12 1.17 1.22 ms

1)

PRQ-770

RR minimum

interval

t

RR_min

6.7 7.1 7.4 ms

1)

PRQ-768

RR maximum

interval time

t

RR_max

149 155.

7

163 ms

1)

7-bit counter

PRQ-769

RR sleep

interval step

t

RR_sleep_LS

B

13.6

4

15 16.6

7

sec

1)

PRQ-773

RR sleep

maximum

interval time

t

RR_sleep_m

ax

3.88 4.26 4.74 h

1)

10-bit counter

PRQ-771

Error counter n

ERROR

0 – 7 -

1)

3-bit counter

PRQ-776

CRC check

cyclic

interval

t

CRC_check

47 49.1

5

52 ms

1)

PRQ-775

(table continues...)

TLE9009DQU

Li-ion battery monitoring and balancing IC

17 Round robin (RR)

Datasheet 61 Rev. 1.0

2024-09-15

Page 62 of 73

Table 20 (continued) Electrical characteristics

V

VS

= V

VS_functional

, T

j

= -40°C to +150°C, all voltages with respect to GND, positive current flowing into pin (unless

otherwise specified)

Parameter Symbol Values Unit Note or condition P-

Number

Min. Typ. Max.

RR

compensatio

n

measuremen

t and

calculation

t

comp

385 405 425 μs

1)

PRQ-1392

ADC ERROR

result

( Σ PCVM

versus BVM)

comparison

error

threshold

ADC_ERR

th

– 256 – mV – PRQ-1304

NTC Open / short diagnostics

NTC short

threshold

NTC_short

t

hr

– 64 – LSB10 Using  I

TMPz_0

with 0 ≤ z ≤ 4  PRQ-1306

NTC open

threshold

NTC_open

t

hr

– 1023 – LSB10 Using  I

TMPz_3

with 0 ≤ z ≤ 4  PRQ-1307

1) Not subject to production test; verified by design or characterization.

TLE9009DQU

Li-ion battery monitoring and balancing IC

17 Round robin (RR)

Datasheet 62 Rev. 1.0

2024-09-15

Page 63 of 73

18 Emergency mode (EMM) and ERR pin (ERR)

18.1 Functional description

One of the following reactions of the IC to an error can be configured in the ERR pin/EMM mask register:

• Indicate the issue via a "high" level on the ERR pin.

• Send an emergency signal (EMM) via iso UART to each adjacent device in the chain.

The ERR pin is protected against short to GND.

The emergency signal is an alternating signal with the frequency f

EMM

. The EMM is received and sent via the iso

UART communication interfaces.

The IC can detect and forward an EMM signal in sleep mode. The EMM signal is used for the IC wake-up. On

detecting an EMM signal, the IC reproduces and forwards it to the opposite iso UART interface.

After the transmit process the IC returns to sleep mode.

EMM communication ( f

EMM

)

Standard iso UART

communication (2 MHz)

Communication Frequency Comparison

Second device on IFL_x RX

First device on IFH_x TX

n

EMM

First device configures

IFH_x as TX

t

WAKE

Second device

configures north IF as TX

First device on IFL_x RX

Fault device IFH & IFL as TX

First device on IFH_x RX

First device on IFL_x TX

Second device on IFH_x RX

Second device on IFL_x TX

Third device on IFH_x RX

Third device on IFL_x RX

Second device on IFH_x TX

t

WAKE

Assuming Sleep mode

t

WAKE

n

EMM

n

EMM

n

EMM

n

EMM

First device receives

EMM signal

n

EMM_dect_wake-up

First device detects

EMM signal

n

EMM_dect_wake-up

Second device detects

EMM signal

n

EMM_dect_wake-up

Second device detects

EMM signal

Figure 27 EMM in sleep mode process

With a chain in sleep mode, the EMM signal reaches the transceiver from both sides.

TLE9009DQU

Li-ion battery monitoring and balancing IC

18 Emergency mode (EMM) and ERR pin (ERR)

Datasheet 63 Rev. 1.0

2024-09-15

Page 64 of 73

Battery

Stack

CSC

Battery

Stack

CSC

CSC

CSC

HV+

HV-

UART

microcontroller

(Comm.)

Host Controller

Transceiver

CSC

transformer

transformer

Interface

Main Relay

Fault OV

TX

Fault OV

Sleep Mode

Fault Communication

TX

RX

RX

RX

RX

RX

TX

TX

RX

RX

Fault Communication

WakeUp

WakeUp

Dir. South

Dir. North

Fault

CSC

CSC

CSC

CSC

HV+

HV-

UART

microcontroller

(Comm.)

Host Controller

Transceiver

CSC

transformer

transformer

Interface

Main Relay

Fault OV

TX

Fault OV

Sleep Mode

Fault Communication

TX

RX

RX

RX

RX

RX

TX

TX

TX

RX

Fault Communication

WakeUp

WakeUp

TX

Fault

Fault

IFH

IFL

IFH

IFL

Figure 28 EMM in sleep mode path

In normal operation the communication mode (PoT or PoB) is already defined and the adjacent device shows

either a TX or RX interface. In case of EMM, the contiguous device showing a TX interface will not forward the

EMM signal. Therefore, the EMM signal follows the path that shows the RX interface back to the microcontroller.

TLE9009DQU

Li-ion battery monitoring and balancing IC

18 Emergency mode (EMM) and ERR pin (ERR)

Datasheet 64 Rev. 1.0

2024-09-15

Page 65 of 73

Assuming PoT mode

Message lost: contiguous device in PoT

configuration

Second device on IFL_x RX

First device on IFH_x TX

First device on IFL_x RX

Fault device IFH & IFL as TX

First device on IFL_x TX

First device on IFH_x RX

Second device on IFL_x TX

Transceiver IFL_x RX

Second device on IFH_x TX

Assuming PoB mode

Message lost: contiguous device in PoB

configuration

Second device on IFL_x TX

First device on IFH_x RX

First device on IFL_x TX

Fault device IFH & IFL as TX

First device on IFH_x RX

First device on IFL_x TX

Second device on IFH_x RX

Second device on IFL_x TX

Transceiver IFH_x RX

Dir. South

Dir. North

Fault device go

to idle mode

First device go

to idle mode

Second device

go to idle mode

Transceiver

EMM detected

Fault device go

to idle mode

First device go

to idle mode

Second device

go to idle mode

Transceiver

EMM detected

Figure 29 EMM in normal mode process

TLE9009DQU

Li-ion battery monitoring and balancing IC

18 Emergency mode (EMM) and ERR pin (ERR)

Datasheet 65 Rev. 1.0

2024-09-15

Page 66 of 73

CSC

Battery

Stack

CSC

CSC

CSC

HV+

HV-

UART

microcontroller

(Comm.)

Host Controller

Transceiver

CSC

transformer

transformer

Interface

Main Relay

Fault OV

RX

TX

RX

TX

RX

TX

TX

TX

RX

TX

Fault OV

Normal Communication: PoB

Fault Communication

RX

TX

Fault OV

Dir. South

Dir. North

Fault

IFH

IFL

IFH

IFL

IFH

IFL

IFH

IFL

IFH

IFL

IFH

IFL

Fault

CSC

CSC

CSC

CSC

HV+

HV-

UART

microcontroller

(Comm.)

Host Controller

Transceiver

CSC

transformer

transformer

Interface

Main Relay

Fault OV

RX

TX

Fault OV

Normal Communication: PoT

Fault Communication

TX

TX

RX

TX

RX

TX

RX

TX

RX

TX

Dir. South

Dir. North

Fault

IFH

IFL

IFH

IFL

IFH

IFL

IFH

IFL

IFH

IFL

IFH

IFL

Fault

Battery

Stack

Figure 30 EMM in normal mode path

A device which sends the EMM signal transmits it for  n

EMM

periods. The number of periods the IC needs

to detect and forward an EMM signal depends on the operation mode:

1. Idle mode:  n

EMM_dect

2. Straight after wake-up caused by EMM:  n

EMM_dect_wake-up

The IC's ERR pin default state is low and is pulled down using the external pull-down resistor  R

ERR_PD

. If the

device detects an error, then it switches the ERR pin to VS until the following actions are performed:

• The microcontroller clears the fault, which triggered the ERR signal.

• The IC enters sleep mode.

If a fault that activates the ERR pin is detected in round robin sleep, then the IC remains in normal mode until

t

WD_max

elapses.

The following faults can trigger the EMM mode or the ERR pin, depending on the configuration in the ERR pin /

EMM mask register:

• Overvoltage or undervoltage of a cell

• External NTC resistance measurement fault

• Open load diagnostics error for any voltage sensing and balancing pin

• Balancing overcurrent and undercurrent error

• ADC cross-check error

• Internal overtemperature detected

• Register CRC check fault detected

• Internal IC error

Setting the corresponding bits in the ERR pin and EMM mask register prevents faults from leading to an

emergency signal (EMM) emission or to an ERR pin reaction.

TLE9009DQU

Li-ion battery monitoring and balancing IC

18 Emergency mode (EMM) and ERR pin (ERR)

Datasheet 66 Rev. 1.0

2024-09-15

Page 67 of 73

18.2 Electrical characteristics emergency mode (EMM) and ERR pin (ERR)

Table 21 Electrical characteristics

V

VS

= V

VS_functional

, T

j

= -40°C to +150°C, all voltages with respect to GND, positive current flowing into pin (unless

otherwise specified)

Parameter Symbol Values Unit Note or condition P-

Number

Min. Typ. Max.

Emergency mode EMM

EMM signal

frequency

f

EMM

48 50 52 kHz

1)

PRQ-737

EMM number

of periods to

detect EMM

signal -

straight after

wake-up

n

EMM_dect_

wake-up

4 – 4 period

s

1)

1. Wake-up due to the EMM signal

2. During forwarding of the wake-up

signal

PRQ-738

EMM number

of periods to

detect EMM

signal - idle

mode

n

EMM_dect

16 – 16 period

s

1)

IC is in idle mode and not enumerated (ID

= 0)

PRQ-740

Transmitted

EMM signal

periods

n

EMM

32 – 32 period

s

1)

PRQ-742

ERR pin function

ERR fault

indication

voltage

V

ERR

V

VS

-

0.25

V

– V

VS

V I

ERR

≤  I

ERR_max

PRQ-743

ERR input

current

I

ERR

-1 – – mA Current capability of pin additionally to

R

ERR_PD

(= 100 k Ω ) current

PRQ-744

ERR pull-

down resistor

R

ERR_PD

75 100 – k Ω External pull down resistance PRQ-745

1) Not subject to production test; verified by design or characterization.

TLE9009DQU

Li-ion battery monitoring and balancing IC

18 Emergency mode (EMM) and ERR pin (ERR)

Datasheet 67 Rev. 1.0

2024-09-15

Page 68 of 73

19 Application information

19.1 External circuitry and components

Other supporting

components

R

Pulldn

R

Pulldn

EMC, Filter, Balancing

Other supporting components

Communication

Communication

TLE9009DQU

CELL

#8

CELL

#7

R

F

R

F

R

F

C

F

U9

G8

U8

G7

U7

36

40

39

38

37

R

BAL

U9P

35

R

BAL

C

FB

C

FB

CELL

#1

CELL

#0

R

F

R

F

G1

U1

G0

U0

2

6

5

4

3

R

BAL

R

BAL

GND

15

IFH_L IFH_H

25 26

IFL_H IFL_L

23 24

C

SER

C

SER

R

SER

R

SER

C

SER

C

SER

R

SER

R

SER

GND

22

VDDC

27

VIO

30

VS (VREGIN)

34

C

VS

C

VDDC

R

F

TMP4

13

TMP0

18

NTC4

NTC0

U2

Vregout(VDDA)

31

C

VREGOUT

VBLK+

VBLK+

TMP_GND

19

Cell Supervision Circuit PCB

R

VS

C

U9P

GND

C

F

C

F

R

F

C

FB

C

F

C

FB

C

EMC

C

EMC

C

EMC

C

EMC

C

EMC

C

isoUART_F

C

isoUART_F

C

isoUART_F

C

TMP

C

EMC

NC

32

C

TMP

C

EMC

C

TMP_GND

R

TMP_GND

C

isoUART_F

R

TMP

R

TMP

ERR

33

GPIOq

29/28

PWMp

20/21

R

Pulldn

C

T_IN

C

T_IN

NTC NTC

R

U9P

7, 8, 9,

10, 11, 12

Figure 31 External circuitry TLE9009DQU

Table 22 External components

Name Symbol Typ. Unit Condition

External filter resistor

RF

R

F

10 Ω Valid for pin U0 - U9

External filter resistor

RU9P

R

U9P

5.1 Ω

External balancing

resistor RBAL

R

BAL

41 Ω

External filter

capacitor CF

C

F

330 nF

EMC network

capacitor CEMC

C

EMC

1 nF

(table continues...)

TLE9009DQU

Li-ion battery monitoring and balancing IC

19 Application information

Datasheet 68 Rev. 1.0

2024-09-15

Page 69 of 73

Table 22 (continued) External components

Name Symbol Typ. Unit Condition

Filter capacitor

(Gn/Un) CFB

C

FB

100 nF

Buffer capacitor CVS C

VS

100 nF

Filtering resistor RVS R

VS

5.1 Ω

Buffer capacitor on

U9P

C

U9P

100 nF

Buffer capacitor on

VREGOUT

C

VREGOUT

100 nF

Buffer capacitor on

VIO

C

VIO

100 nF If VIO is connected

to VREGOUT,

then C

VIO

is omitted.

Buffer capacitor on

VDDC

C

VDDC

330 nF

Bypass capacitor on

iso UART

C

isoUART_F

220 pF

Input capacitor on

TMP

C

TMP

10 nF

NTC filter resistor

RTMP

R

TMP

100 Ω

NTC filter capacitor

CT_IN

C

T_IN

4.7 nF

External wiring

resistance

R

WH_ch

0.2 Ω

TLE9009DQU

Li-ion battery monitoring and balancing IC

19 Application information

Datasheet 69 Rev. 1.0

2024-09-15

Page 70 of 73

19.2 Typical application diagram

Cell Supervision Circuit (CSC)

Cell #8

Cell #7

Cell #0

Cell #8

Cell #7

Cell #0

twisted pair cable

CSC

To transceiver IC

UART – iso UART

transceiver

Several

other CSCs

Several other

battery modules

Cell #8

Cell #7

Cell #0

BMS

UART

to MCU

Cell

balancing

Cell voltage

(ASIL-D)

iso UART

Sensing IC

NTC meas.

(ASIL-D)

Diagnostics unit

UART

Supply

Cell

balancing

Cell voltage

(ASIL-D)

iso UART

Sensing IC

NTC meas.

(ASIL-D)

Diagnostics unit

UART

Supply

Cell

balancing

Cell voltage

(ASIL-D)

iso UART

Sensing IC

NTC meas.

(ASIL-D)

Diagnostics unit

UART

Supply

Figure 32 Typical application diagram

TLE9009DQU

Li-ion battery monitoring and balancing IC

19 Application information

Datasheet 70 Rev. 1.0

2024-09-15

Page 71 of 73

20 Package information

1

48

48

1

The drawing is in compliance with ISO 128-30, Projection Method 1 [ ]

All dimensions are in units mm

9

7

7

9

5

5

1

±0.05

1.2 Max

0.6 ±0.15

0.1

±0.05

0.5 × 45°

1)

1)

1) Does not include plastic or metal protrusion of 0.25 Max per side

Exposed diepad

Stand Off

0°...7°

0.125

+0.075

-0.035

0.5

0.22 ±0.05

Pin1 Marking

Seating plane

Coplanarity

2) Exposed pad for soldering purpose

Drawing according to ISO 8015, general tolerances ISO 2769-mk

Figure 33 PG-TQFP-48

Green Product (RoHS compliant)

To meet the world-wide customer requirements for environmentally friendly products and to be compliant with

government regulations the device is available as a Green Product. Green Products are RoHS compliant (Pb-

free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020).

Information on alternative packages

Please visit www.infineon.com/packages .

TLE9009DQU

Li-ion battery monitoring and balancing IC

20 Package information

Datasheet 71 Rev. 1.0

2024-09-15

Page 72 of 73

21 Revision history

Revision Date Changes

1.0 2024-09-15 Datasheet release

TLE9009DQU

Li-ion battery monitoring and balancing IC

21 Revision history

Datasheet 72 Rev. 1.0

2024-09-15

Page 73 of 73

Trademarks

All referenced product or service names and trademarks are the property of their respective owners.

Edition 2024-09-15

Published by

Infineon Technologies AG

81726 Munich, Germany

©

2024 Infineon Technologies AG

All Rights Reserved.

Do you have a question about any

aspect of this document?

Email: erratum@infineon.com

Document reference

IFX-Z8F80411122

Important notice

The information given in this document shall in no

event be regarded as a guarantee of conditions or

characteristics (“Beschaffenheitsgarantie”).

With respect to any examples, hints or any typical

values stated herein and/or any information regarding

the application of the product, Infineon Technologies

hereby disclaims any and all warranties and liabilities

of any kind, including without limitation warranties of

non-infringement of intellectual property rights of any

third party.

In addition, any information given in this document is

subject to customer’s compliance with its obligations

stated in this document and any applicable legal

requirements, norms and standards concerning

customer’s products and any use of the product of

Infineon Technologies in customer’s applications.

The data contained in this document is exclusively

intended for technically trained staff. It is the

responsibility of customer’s technical departments to

evaluate the suitability of the product for the intended

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information given in this document with respect to such

application.

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Due to technical requirements products may contain

dangerous substances. For information on the types

in question please contact your nearest Infineon

Technologies office.

Except as otherwise explicitly approved by Infineon

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authorized representatives of Infineon Technologies,

Infineon Technologies’ products may not be used in

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